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TS5A3154DCURE4 bảng dữ liệu(PDF) 1 Page - Texas Instruments |
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TS5A3154DCURE4 bảng dữ liệu(HTML) 1 Page - Texas Instruments |
1 / 29 page DCUPACKAGE (TOP VIEW) 1 2 3 8 6 COM EN GND NO V+ 7 NC Logic Control 4 5 IN GND 2 YZP PACKAGE (BOTTOMVIEW) GND GND EN COM NC NO IN V+ 1 A1 B1 C1 D1 3 4 8 7 5 6 Logic Control A2 B2 C2 D2 TS5A3154 www.ti.com SCDS191C – MARCH 2005 – REVISED FEBRUARY 2012 0.9- Ω SPDT ANALOG SWITCH 5-V/3.3-V SINGLE-CHANNEL 2:1 MULTIPLEXER/DEMULTIPLEXER Check for Samples: TS5A3154 1 FEATURES APPLICATIONS 2 • Specified Make-Before-Break Switching • Cell Phones • Low ON-State Resistance (0.9 Ω) • PDAs • Control Inputs Are 5.5-V Tolerant • Portable Instrumentation • Low Charge Injection • Audio and Video Signal Routing • Excellent ON-State Resistance Matching • Low-Voltage Data-Acquisition Systems • Low Total Harmonic Distortion (THD) • Communication Circuits • 1.65-V to 5.5-V Single-Supply Operation • Modems • Latch-Up Performance Exceeds 100 mA Per • Hard Drives JESD 78, Class II • Computer Peripherals • ESD Performance Tested Per JESD 22 • Wireless Terminals and Peripherals – 2000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) DESCRIPTION/ORDERING INFORMATION The TS5A3154 is a single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to 5.5 V. The device offers a low ON-state resistance and an excellent channel-to-channel ON-state resistance matching. The device has excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications. Table 1. ORDERING INFORMATION TA PACKAGE(1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3) NanoFree ™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP Reel of 3000 TS5A3154YZPR _ _ _JX_ –40°C to 85°C (Pb-free) SSOP – DCU Reel of 3000 TS5A3154DCUR JCF_ (1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. (3) DCU: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2005–2012, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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