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LMH6321 bảng dữ liệu(PDF) 2 Page - Texas Instruments |
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LMH6321 bảng dữ liệu(HTML) 2 Page - Texas Instruments |
2 / 31 page LMH6321 SNOSAL8B – APRIL 2006 – REVISED APRIL 2007 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) ESD Tolerance (3) Human Body Model 2.5 kV Machine Model 250V Supply Voltage 36V (±18V) Input to Output Voltage (4) ±5V Input Voltage ±VSUPPLY Output Short-Circuit to GND (5) Continuous Storage Temperature Range −65°C to +150°C Junction Temperature (TJMAX) +150°C Lead Temperature (Soldering, 10 seconds) 260°C Power Dissipation (6) CL Pin to GND Voltage ±1.2V (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For specifications and the test conditions, see the Electrical Characteristics Table. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) Human Body Model is 1.5 k Ω in series with 100 pF. Machine Model is 0Ω in series with 200 pF. (4) If the input-output voltage differential exceeds ±5V, internal clamping diodes will turn on. The current through these diodes should be limited to 5 mA max. Thus for an input voltage of ±15V and the output shorted to ground, a minimum of 2 k Ω should be placed in series with the input. (5) The maximum continuous current must be limited to 300mA. See APPLICATION HINTS for more details. (6) The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = TJ(MAX)–TA)/θJA. See THERMAL MANAGEMENT of APPLICATION HINTS. OPERATING RATINGS Operating Temperature Range −40°C to +125°C Operating Supply Range 5V to ±16V Thermal Resistance ( θJA), SO PowerPAD Package (1) 180°C/W Thermal Resistance ( θJC) DDPAK Package 4°C/W Thermal Resistance ( θJA) DDPAK Package 80°C/W (1) Soldered to PC board with copper foot print equal to DAP size. Natural convection (no air flow). Board material is FR-4. 2 Submit Documentation Feedback Copyright © 2006–2007, Texas Instruments Incorporated Product Folder Links: LMH6321 |
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Mô tả tương tự - LMH6321_14 |
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