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LMH6321 bảng dữ liệu(PDF) 2 Page - Texas Instruments

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LMH6321
SNOSAL8B – APRIL 2006 – REVISED APRIL 2007
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1) (2)
ESD Tolerance (3)
Human Body Model
2.5 kV
Machine Model
250V
Supply Voltage
36V (±18V)
Input to Output Voltage (4)
±5V
Input Voltage
±VSUPPLY
Output Short-Circuit to GND (5)
Continuous
Storage Temperature Range
−65°C to +150°C
Junction Temperature (TJMAX)
+150°C
Lead Temperature
(Soldering, 10 seconds)
260°C
Power Dissipation
(6)
CL Pin to GND Voltage
±1.2V
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For specifications and the test conditions, see the
Electrical Characteristics Table.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3)
Human Body Model is 1.5 k
Ω in series with 100 pF. Machine Model is 0Ω in series with 200 pF.
(4)
If the input-output voltage differential exceeds ±5V, internal clamping diodes will turn on. The current through these diodes should be
limited to 5 mA max. Thus for an input voltage of ±15V and the output shorted to ground, a minimum of 2 k
Ω should be placed in series
with the input.
(5)
The maximum continuous current must be limited to 300mA. See APPLICATION HINTS for more details.
(6)
The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = TJ(MAX)–TA)/θJA. See THERMAL MANAGEMENT of APPLICATION HINTS.
OPERATING RATINGS
Operating Temperature Range
−40°C to +125°C
Operating Supply Range
5V to ±16V
Thermal Resistance (
θJA),
SO PowerPAD Package (1)
180°C/W
Thermal Resistance (
θJC)
DDPAK Package
4°C/W
Thermal Resistance (
θJA)
DDPAK Package
80°C/W
(1)
Soldered to PC board with copper foot print equal to DAP size. Natural convection (no air flow). Board material is FR-4.
2
Submit Documentation Feedback
Copyright © 2006–2007, Texas Instruments Incorporated
Product Folder Links: LMH6321


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