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ADC12DL080 bảng dữ liệu(PDF) 6 Page - Texas Instruments

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ADC12DL080
SNAS345 – FEBRUARY 2006
www.ti.com
Pin No.
Symbol
Equivalent Circuit
Description
The ground return for the digital supply for the ADC12DL080's output
drivers. These pins should be connected to the system digital
23, 31, 40,
DRGND
ground, but not be connected in close proximity to the
50, 58
ADC12DL080's DGND or AGND pins. See LAYOUT AND
GROUNDING (Layout and Grounding) for more details.
Absolute Maximum Ratings
(1) (2)
VA, VD, VDR
4.2V
|VA–VD|
≤ 100 mV
Voltage on Any Input or Output Pin
−0.3V to (VA or VD +0.3V)
Input Current at Any Pin (3)
±25 mA
Package Input Current (3)
±50 mA
Package Dissipation at TA = 25°C
See (4)
ESD Susceptibility
Human Body Model (5)
2500V
Machine Model (5)
250V
Charge Device Model
750V
Soldering Temperature,
Infrared, 10 sec. (6)
235°C
Storage Temperature
−65°C to +150°C
Soldering process must comply with National Semiconductor's Reflow Temperature Profile specifications. Refer to
www.national.com/packaging. (6)
(1)
All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.
(2)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see
the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics
may degrade when the device is not operated under the listed test conditions.
(3)
When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be
limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies
with an input current of 25 mA to two.
(4)
The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by
TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature, (TA), and can be calculated using the formula
PDMAX = (TJmax - TA )/θJA. In the 64-pin TQFP, θJA is 50°C/W, so PDMAX = 2 Watts at 25°C and 800 mW at the maximum operating
ambient temperature of 85°C. Note that the power consumption of this device under normal operation will typically be about 497 mW
(447 typical power consumption + 50 mW TTL output loading). The values for maximum power dissipation listed above will be reached
only when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply
voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided.
(5)
Human body model is 100 pF capacitor discharged through a 1.5 k
Ω resistor. Machine model is 220 pF discharged through 0Ω.
(6)
Reflow Reflow temperature profiles are different for lead-free and non-lead-free packages.
Operating Ratings
(1) (2)
Operating Temperature
−40°C ≤ TA ≤ +85°C
Supply Voltage (VA, VD)
+3.0V to +3.6V
Output Driver Supply (VDR)
+2.4V to VD
CLK, PD, OF/DOEN, OEA/OF, OEB/DRDY
−0.05V to (VD + 0.05V)
Analog Input Pins
0V to 2.6V
VCM
1.0V to 2.0V
|AGND–DGND|
≤100mV
Clock Duty Cycle (DCS On)
30% to 70%
Clock Duty Cycle (DCS Off)
40% to 60%
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see
the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics
may degrade when the device is not operated under the listed test conditions.
(2)
All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.
6
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Copyright © 2006, Texas Instruments Incorporated
Product Folder Links: ADC12DL080


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