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ADC12C170 bảng dữ liệu(PDF) 5 Page - Texas Instruments

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Giải thích chi tiết về linh kiện  12-Bit, 170 MSPS, 1.1 GHz Bandwidth A/D Converter with CMOS Outputs
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ADC12C170
www.ti.com
SNAS374D – DECEMBER 2006 – REVISED APRIL 2009
Absolute Maximum Ratings
(1) (2) (3)
Supply Voltage (VA, VD)
−0.3V to 4.2V
Supply Voltage (VDR)
−0.3V to 2.35V
|VA–VD|
≤ 100 mV
Voltage on Any Input Pin
−0.3V to (VA +0.3V)
(Not to exceed 4.2V)
Voltage on Any Output Pin
-0.3V to (VDR +0.2V)
(Not to exceed 2.35V)
Input Current at Any Pin other than Supply Pins (4)
±5 mA
Package Input Current (4)
±50 mA
Max Junction Temp (TJ)
+150°C
Thermal Resistance (
θJA)
24°C/W
Package Dissipation at TA = 25°C
(5)
5.2W
ESD Rating
Human Body Model (6)
2000 V
Machine Model (6)
200 V
Charge Device Model
1000 V
Storage Temperature
−65°C to +150°C
Soldering process must comply with TI's Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.(7)
(1)
All voltages are measured with respect to GND = AGND = DGND = DRGND = 0V, unless otherwise specified.
(2)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is specified to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the
maximum Operating Ratings is not recommended.
(3)
If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(4)
When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be
limited to ±5 mA. The ±50 mA maximum package input current rating limits the number of pins that can safely exceed the power
supplies with an input current of ±5 mA to 10.
(5)
The maximum allowable power dissipation is dictated by TJ,max, the junction-to-ambient thermal resistance, (θJA), and the ambient
temperature, (TA), and can be calculated using the formula PD,max = (TJ,max - TA )/θJA. The values for maximum power dissipation listed
above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the
power supply voltages, or the power supply polarity is reversed). Such conditions should always be avoided.
(6)
Human Body Model is 100 pF discharged through a 1.5 k
Ω resistor. Machine Model is 220 pF discharged through 0 Ω
(7)
Reflow temperature profiles are different for lead-free and non-lead-free packages.
Operating Ratings
(1) (2)
Operating Temperature
−40°C ≤ TA ≤ +85°C
Supply Voltage (VA, VD)
+3.0V to +3.6V
Output Driver Supply (VDR)
+1.6V to +2.0V
CLK
−0.05V to (VA + 0.05V)
Clock Duty Cycle
30/70 %
Analog Input Pins
0V to 2.6V
VCM
1.4V to 1.6V
|AGND-DGND|
≤100mV
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is specified to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance
characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the
maximum Operating Ratings is not recommended.
(2)
All voltages are measured with respect to GND = AGND = DGND = DRGND = 0V, unless otherwise specified.
Copyright © 2006–2009, Texas Instruments Incorporated
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