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ADC12C170 bảng dữ liệu(PDF) 5 Page - Texas Instruments |
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ADC12C170 bảng dữ liệu(HTML) 5 Page - Texas Instruments |
5 / 29 page ADC12C170 www.ti.com SNAS374D – DECEMBER 2006 – REVISED APRIL 2009 Absolute Maximum Ratings (1) (2) (3) Supply Voltage (VA, VD) −0.3V to 4.2V Supply Voltage (VDR) −0.3V to 2.35V |VA–VD| ≤ 100 mV Voltage on Any Input Pin −0.3V to (VA +0.3V) (Not to exceed 4.2V) Voltage on Any Output Pin -0.3V to (VDR +0.2V) (Not to exceed 2.35V) Input Current at Any Pin other than Supply Pins (4) ±5 mA Package Input Current (4) ±50 mA Max Junction Temp (TJ) +150°C Thermal Resistance ( θJA) 24°C/W Package Dissipation at TA = 25°C (5) 5.2W ESD Rating Human Body Model (6) 2000 V Machine Model (6) 200 V Charge Device Model 1000 V Storage Temperature −65°C to +150°C Soldering process must comply with TI's Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.(7) (1) All voltages are measured with respect to GND = AGND = DGND = DRGND = 0V, unless otherwise specified. (2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is specified to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating Ratings is not recommended. (3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. (4) When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be limited to ±5 mA. The ±50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of ±5 mA to 10. (5) The maximum allowable power dissipation is dictated by TJ,max, the junction-to-ambient thermal resistance, (θJA), and the ambient temperature, (TA), and can be calculated using the formula PD,max = (TJ,max - TA )/θJA. The values for maximum power dissipation listed above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Such conditions should always be avoided. (6) Human Body Model is 100 pF discharged through a 1.5 k Ω resistor. Machine Model is 220 pF discharged through 0 Ω (7) Reflow temperature profiles are different for lead-free and non-lead-free packages. Operating Ratings (1) (2) Operating Temperature −40°C ≤ TA ≤ +85°C Supply Voltage (VA, VD) +3.0V to +3.6V Output Driver Supply (VDR) +1.6V to +2.0V CLK −0.05V to (VA + 0.05V) Clock Duty Cycle 30/70 % Analog Input Pins 0V to 2.6V VCM 1.4V to 1.6V |AGND-DGND| ≤100mV (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is specified to be functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating Ratings is not recommended. (2) All voltages are measured with respect to GND = AGND = DGND = DRGND = 0V, unless otherwise specified. Copyright © 2006–2009, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: ADC12C170 |
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