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2 / 27 page GAIN 1-5 ADC 5 LATCH RF LO LMH6515 VCC LMH6515 SNOSAX4B – AUGUST 2007 – REVISED OCTOBER 2007 www.ti.com Typical Application These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) ESD Tolerance(3) Human Body Model 2 kV Machine Model 150V Positive Supply Voltage (Pin 3) −0.6V to 5.5V Output Voltage (pin 14,15) −0.6V to 6.8V Differential Voltage Between Any Two Grounds <200 mV Analog Input Voltage Range −0.6V to VCC Digital Input Voltage Range −0.6V to 3.6V Output Short Circuit Duration (one pin to ground) Infinite Junction Temperature +150°C Storage Temperature Range −65°C to +150°C Soldering Information Infrared or Convection (20 sec) 235°C Wave Soldering (10 sec) 260°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical Characteristics tables. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. (3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC). OPERATING RATINGS (1) Supply Voltage (Pin 3) 4V to 5.25V Output Voltage Range (Pin 14, 15) 1.4V to 6.4V Differential Voltage Between Any Two Grounds <10 mV Analog Input Voltage Range, AC Coupled ±1.4V Temperature Range(2) −40°C to +85°C Package Thermal Resistance ( θJA) 16-Pin WQFN 47°C/W (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not ensured. For ensured specifications, see the Electrical Characteristics tables. (2) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board. 2 Submit Documentation Feedback Copyright © 2007, Texas Instruments Incorporated Product Folder Links: LMH6515 |
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