Filtronic

.5-8GHz MESFET Amplifier

Solid State

LMA110B

Assembly Diagram

OPTIMUM BIAS SCHEME

Notes:

1.) Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25µm) diameter wire. The bond

tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is recommended.

Ultrasonic bonding is not recommended.

2.) The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150°C for 45 minutes.

3.) Bond on bond or stitch bond acceptable.

4.) Conductor over conductor acceptable. Conductors must not short.

DSS 005 WD