CYStech Electronics Corp.

Spec. No. : C827I3

Issued Date : 2013.01.04

Revised Date :

Page No. : 6/6

TIP50I3

CYStek Product Specification

TO-251S Dimension

*: Typical

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.256

0.264

6.500

6.700

K

0.138 REF

3.500 REF

B

0.201

0.215

5.100

5.460

L

0.036

0.046

0.910

1.110

C

0.409

0.433

10.400

11.000

L2

0.063 REF

1.600 REF

E

0.026

0.034

0.660

0.860

M

0.018

0.023

0.460

0.580

F

0.086

0.094

2.186

2.386

S

0.190 REF

4.830 REF

H

0.018

0.023

0.460

0.580

T

0.211 REF

5.350 REF

h

0.000

0.012

0.000

0.300

U

0.070 REF

1.780 REF

I

0.087

0.094

2.200

2.400

V

0.030 REF

0.760 REF

J

0.236

0.244

6.000

6.200

Φ

0.043

0.051

1.100

1.300

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: Pure tin plated.

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Marking :

Style : Pin 1. Base 2. Collector 3. Emitter

3-Lead TO-251S Plastic Package

CYStek Package Code: I3

Device Name

Date

Code

TIP50

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