CYStech Electronics Corp.

Spec. No. : C506J3

Issued Date : 2007.07.10

Revised Date :2011.08.11

Page No. : 7/8

LM1117-XXXJ3

CYStek Product Specification

TO-252AB Dimension

*: Typical

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.087

0.094

2.200

2.400

e

*0.091

*2.300

A1

0.000

0.005

0.000

0.127

e1

0.177

0.185

4.500

4.700

B

0.053

0.065

1.350

1.650

H

0.118 REF

3.000 REF

b

0.020

0.028

0.500

0.700

K

0.197 REF

5.000 REF

b1

0.028

0.035

0.700

0.900

L

0.374

0.390

9.500

9.900

C

0.017

0.023

0.430

0.580

L1

0.100

0.114

2.550

2.900

C1

0.017

0.023

0.430

0.580

L2

0.055

0.070

1.400

1.780

D

0.250

0.262

6.350

6.650

L3

0.024

0.035

0.600

0.900

D1

0.205

0.213

5.200

5.400

P

0.028 REF

0.700 REF

E

0.213

0.224

5.400

5.700

V

0.209 REF

5.300 REF

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead : Pure tin plated

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

4

Marking:

Style: Pin 1.Vin 2.Ground 3.Vout

4.Ground

3-Lead TO-252AB Plastic Surface Mount Package

CYStek Package Code: J3

Device

Name

Date

Code

□□□□

1.5V→-15

1.8V→-18

2.5V→-25

3.3V→-33

5.0V→-50

ADJ→blank