CYStech Electronics Corp.

Spec. No. : C545P8

Issued Date : 2010.12.20

Revised Date :

Page No. : 6/6

LM393P8

CYStek Product Specification

DIP-8 Dimension

Inches

Millimeters

Inches

Millimeters

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

DIP-8 Plastic Package

CYStek Package Code : P8

Marking:

Device

Name

LM393

□□□□

Date

Code

A

-

0.021

-

0.5334

c1

0.008

0.011

0.203

0.279

A1

0.015

-

0.381

-

D

0.355

0.400

9.017

10.16

A2

0.115

0.195

2.921

4.953

E

0.240

0.280

6.096

7.112

b

0.014

0.022

0.356

0.559

E1

0.300

0.325

7.620

8.255

b1

0.014

0.020

0.356

0.508

e

0.100 BSC

2.540BSC

b2

0.045

0.046

1.143

1.778

HE

-

0.430

-

10.92

b3

0.030

0.045

0.762

1.143

L

0.115

0.150

2.921

3.810

c

0.008

0.014

0.203

0.356

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material :

• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.