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NEXC224Z35V105X55TRF bảng dữ liệu(PDF) 1 Page - NIC-Components Corp.

tên linh kiện NEXC224Z35V105X55TRF
Giải thích chi tiết về linh kiện  V-Chip Memory Back-Up Capacitors
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nhà sản xuất  NIC [NIC-Components Corp.]
Trang chủ  http://www.niccomp.com
Logo NIC - NIC-Components Corp.

NEXC224Z35V105X55TRF bảng dữ liệu(HTML) 1 Page - NIC-Components Corp.

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NIC COMPONENTS CORP. www.niccomp.com www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
SPECIFICATIONS ARE SUBJECT TO CHANGE
V-Chip Memory Back-Up Capacitors
NEXC Series
NIC P/N
Capacitance
Value (F)
Discharge
Working
Voltage
(VDC)
Holding
Voltage
(VDC min.)
Max. Current
@ 30 minutes
(mA)
Max. ESR
@ 1KHz
(
Ω)
NEXC104Z3.5V10.5X5.5TRF
0.1
3.5
-
0.090
50
NEXC224Z3.5V10.5X5.5TRF
0.22
3.5
-
0.200
25
NEXC474Z3.5V10.5X8.5TRF
0.47
3.5
-
0.420
25
NEXC473Z5.5V10.5X5.5TRF
0.047
5.5
4.2
0.071
50
NEXC104Z5.5V10.5X5.5TRF
0.1
5.5
4.2
0.150
25
NEXC224Z5.5V10.5X8.5TRF
0.22
5,5
4.2
0.330
25
NEXC474Z5.5V16X9.5TRF
0.47
5.5
4.2
0.710
13
NEXC105Z5.5V21X10.5TRF
1.0
5.5
4.2
1.500
7
Rated Voltage Range
3.5 & 5.5VDC
Rated Capacitance Range
0.047F ~ 1.0F (47,000
μF ~ 1,000,000μF)
Operating Temp. Range
-25°C ~ +70°C
Capacitance Tolerance
+80%/-20% (Z)
Load Life Test
+70°C 1,000 hours
Δ Capacitance Change
Less than ±30% of initial measured value
Maximum ESR
Less than 200% of the specified maximum value
Current at 30 minutes
Less than 200% of the specified maximum value
Temperature Cycling
(5 cycles, -25 ~ +70°C
Δ Capacitance Change
Within +80%/-20% of specified value
Maximum ESR
Less than specified maximum value
Current at 30 minutes
Less than specified maximum value
Humidity Resistance
(240 hours @ 40°C/90% RH)
Δ Capacitance Change
Less than ±20% of initial measured value
Maximum ESR
Less than 120% of the specified maximum value
Current at 30 minutes
Less than 120% of the specified maximum value
Case Size
D
φ ± 0.5 L max. A/B ±0.2
I
W
P
10.5 x 5.5
10.5
5.5
10.8
3.6 ±0.5
1.2
5.0
10.5 x 8.5
10.5
8.5
10.8
3.6 ±0.5
1.2
5.0
16 x 9.5
16.0
9.5
16.3
6.8 ±1.0
1.2
5.0
21 x 10.5
21.0
10.5
21.6
7.0 ±1.0
1.4
10.0
FEATURES
• DOUBLE LAYER CONSTRUCTION
• POWER BACK-UP FOR CMOS DEVICES
• SURFACE MOUNTABLE V-CHIP STYLE
• LEAD-FREE FINISH
CASE DIMENSIONS (mm)
STANDARD VALUES AND SPECIFICATIONS
CHARACTERISTICS
+
-
0.3mm max.
D
φ
w
P
B
A
I
L
I
I
PRECAUTIONS
WASHING is NOT RECOMMENDED. Additional precautions can be found at
www.niccomp.com/precautions
If in doubt or uncertainty, please review your specific application - process details
with NIC’s technical support personnel: tpmg@niccomp.com
*For high temperature +85°C,
high temperature reflow parts
see the NEXCW series


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