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BTB4511J3 bảng dữ liệu(PDF) 6 Page - Cystech Electonics Corp. |
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BTB4511J3 bảng dữ liệu(HTML) 6 Page - Cystech Electonics Corp. |
6 / 6 page CYStech Electronics Corp. Spec. No. : C662J3 Issued Date : 2010.10.26 Revised Date : 2010.12.08 Page No. : 6/6 BTB4511J3 CYStek Product Specification TO-252 Dimension Inches Millimeters Inches Millimeters DIM Min. Max. Min. Max. DIM Min. Max. Min. Max. A 0.087 0.094 2.200 2.400 e 0.086 0.094 2.186 2.386 A1 0.000 0.005 0.000 0.127 e1 0.172 0.188 Marking: Device Name Date Code B4511 □□□□ 1 2 3 4 Style: Pin 1.Base 2.Collector 3.Emitter 4.Collector 3-Lead TO-252 Plastic Surface Mount Package CYStek Package Code: J3 4.372 4.772 B 0.039 0.048 0.990 1.210 H 0.163 REF 4.140 REF b 0.026 0.034 0.660 0.860 K 0.190 REF 4.830 REF b1 0.026 0.034 0.660 0.860 L 0.386 0.409 9.800 10.400 C 0.018 0.023 0.460 0.580 L1 0.114 REF 2.900 REF C1 0.018 0.023 0.460 0.580 L2 0.055 0.067 1.400 1.700 D 0.256 0.264 6.500 6.700 L3 0.024 0.039 0.600 1.000 D1 0.201 0.215 5.100 5.460 P 0.026 REF 0.650 REF E 0.236 0.244 6.000 6.200 V 0.211 REF 5.350 REF Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead : Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. |
Số phần tương tự - BTB4511J3 |
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Mô tả tương tự - BTB4511J3 |
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