SI-8001FDE datasheet(5/9 Pages) SANKEN

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SANKEN ELECTRIC CO., LTD.

DC-to-DC Step-Down Converter

SI-8001FDE

27469.056

Thermal Performance Characteristics

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0

–25

0

25

50

75

100

125

Power Dissipation versus Ambient Temperature

T

J(max) = 125°C; Mounted on glass-epoxy PCB (40 mm × 40 mm),

with varying exposed copper areas

TA (°C)

Cu Area: 1600 mm2

RθJA = 33.3°C/W

Cu Area: 800 mm2

RθJA = 37°C/W

Cu Area: 400 mm2

RθJA = 44°C/W

Cu Area: 100 mm2

RθJA = 53°C/W

Device Thermal Resistance versus Exposed Copper Area on PCB

Glass-epoxy PCB, 40 mm × 40 mm

Copper Area (mm2)

55

50

45

40

35

30

0

800

1000

1200

1400

1600

200

400

600

1800

6

5

4

3

2

1

0

20

40

60

80

100 120 140

180

160

TJ (°C)

Overtemperature

Protection:

Output Voltage versus

Junction Temperature

V

IN = 15 V, IO = 10 mA

OTP On

OTP Off

The application must be designed to ensure that the TJ(max)

of the device is not exceeded during operation. To do so, it is

necessary to determine values for maximum power dissipation,

PD(max), and ambient temperature, TA(max).

The relationships of TJ, PD, TA, and case temperature, TC, are as

shown in the following formulas:

TJ – TC

RθJC

PD =

TJ – TA

RθJA

PD =

and

.

PD can be calculated from input values:

⎟⎟

⎠

⎞

⎜⎜

⎝

⎛

−

⋅

−

⎟⎟

⎠

⎞

⎜⎜

⎝

⎛

−

⋅

=

IN

O

F

x

O

D

V

I

V

I

V

P

1

100

where:

VO is output voltage in V,

VIN is input supply voltage in V,

IO is output current in A,

ηx is IC efficiency in percent (varies with VIN and IO; refer to

efficiency performance curves for value), and

VF is forward voltage for the input diode, Di. In these tests, the

Sanken SPB-G56S was used, at 0.4 V. For application design,

obtain thermal data from the datasheet for the diode.

PD is substantially affected by the heat conductance properties of

the application, in particular any exposed copper area on the PCB

where the device is mounted. The relationships of PD, TA, and

copper area is represented in the Power Dissipation chart.

RθJA for a given copper area can be determined form the Device

Thermal Resistance chart. This can be substituted into the formula

above to determine the TJ (max) allowable in the application.

Generally, more than 10% to 20% derating is required.

Because the heat dissipation capacity of the copper area depends

substantively on how it is used in the actual application, thermal

characteristics of the application must be confirmed by testing.

TC is determined by connecting a thermocouple to the device as

shown here:

Thermocouple mount

at tab center

And analyzing the results using the following formula:

TJ = PD × RθJC + TC ,

for this device, RθJC is 3 °C/W.

Số phần tương tự - SI-8001FDE

nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
Sanken electric	SI-8001FDE	357Kb / 9P	DC-to-DC Step-Down Converter
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