2

®

ADS7819

3

At T

ADS7819P, U

ADS7819PB, UB

PARAMETER

CONDITIONS

MIN

TYP

MAX

MIN

TYP

MAX

UNITS

POWER SUPPLIES

Specified Performance

+4.75

+5

+5.25

*

*

*

V

–5.25

–5

–4.75

*

*

*

V

+16

*

mA

+16

*

mA

–13

*

mA

Derated Performance

+4.5

+5

+5.5

*

*

*

V

–5.5

–5

–4.5

*

*

*

V

Power Dissipation

225

275

*

mW

TEMPERATURE RANGE

Specified Performance

–40

+85

*

*

°C

Derated Performance

–55

+125

*

*

°C

Storage

–65

+150

*

*

°C

Thermal Resistance (

θ

Plastic DIP

75

*

°C/W

SOIC

75

*

°C/W

NOTES: (1) LSB means Least Significant Bit. For the 12-bit,

±2.5V input ADS7819, one LSB is 1.22mV. (2) Typical rms noise at worst case transitions and

temperatures. (3) Measured with 50

Ω in series with analog input. Adjustable to zero with external potentiometer. (4) Full scale error is the worst case of –Full Scale

or +Full Scale untrimmed deviation from ideal first and last code transitions, divided by the transition voltage (not divided by the full-scale range) and includes the

effect of offset error. (5) All specifications in dB are referred to a full-scale

±2.5V input. (6) Usable Bandwidth defined as Full-Scale input frequency at which Signal-

to-(Noise+Distortion) degrades to 60dB, or 10 bits of accuracy. (7) Recovers to specified performance after 2 x FS input over voltage.

ABSOLUTE MAXIMUM RATINGS

CAP ........................................... Indefinite Short to AGND2

Ground Voltage Differences: DGND, AGND1, AGND2 ...................

±0.3V

Maximum Junction Temperature ................................................... +165

°C

Internal Power Dissipation ............................................................. 825mW

Lead Temperature (soldering, 10s) ................................................ +300

°C

MINIMUM

MAXIMUM

SIGNAL-TO-

INTEGRAL

(NOISE +

SPECIFICATION

LINEARITY

DISTORTION)

TEMPERATURE

PACKAGE DRAWING

MODEL

ERROR (LSB)

RATIO (dB)

RANGE

PACKAGE

ADS7819P

±1

68

–40

°C to +85°C

28-Pin Plastic DIP

246

ADS7819PB

±0.75

70

–40

°C to +85°C

28-Pin Plastic DIP

246

ADS7819U

±1

68

–40

°C to +85°C

28-Pin SOIC

217

ADS7819UB

±0.75

70

–40

°C to +85°C

28-Pin SOIC

217

ORDERING AND PACKAGE INFORMATION

NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix D of Burr-Brown IC Data Book.

ELECTROSTATIC

DISCHARGE SENSITIVITY

Electrostatic discharge can cause damage ranging from

performance degradation to complete device failure. Burr-

Brown Corporation recommends that all integrated circuits be

handled and stored using appropriate ESD protection

methods.