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LM2937ES-2.5/NOPB bảng dữ liệu(PDF) 2 Page - Texas Instruments

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Giải thích chi tiết về linh kiện  LM2937-2.5, LM2937-3.3 400mA and 500mA Voltage Regulators
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LM2937ES-2.5/NOPB bảng dữ liệu(HTML) 2 Page - Texas Instruments

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LM2937-2.5, LM2937-3.3
SNVS015E – FEBRUARY 1998 – REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2)
Input Voltage
Continuous
26V
Transient (t
≤ 100 ms)
60V
Internal Power Dissipation (3)
Internally Limited
Maximum Junction Temperature
150°C
Storage Temperature Range
−65°C to +150°C
Lead Temperature Soldering
TO-220 (10 seconds)
260°C
DDPAK/TO-263 (10 seconds)
230°C
SOT-223 (Vapor Phase, 60 seconds)
215°C
SOT-223 (Infrared, 15 seconds)
220°C
ESD Susceptibility (4)
2 kV
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device outside of its rated Operating Conditions.
(2)
If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3)
The maximum allowable power dissipation at any ambient temperature is PMAX = (125 − TA)/θJA, where 125 is the maximum junction
temperature for operation, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is
exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above
150°C, the regulator will go into thermal shutdown. The junction-to-ambient thermal resistance
θJA is 65°C/W, for the TO-220 package,
73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink,
θJA is the sum of the
device junction-to-case thermal resistance
θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the DDPAK/TO-263 or
SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to
the package (see Application Hints for more information on heatsinking).
(4)
ESD rating is based on the human body model, 100 pF discharged through 1.5 k
Ω.
Operating Conditions
(1)
Temperature Range (2)
LM2937ES, LM2937ET
−40°C ≤ TA ≤ 125°C
LM2937IMP
−40°C ≤ TA ≤ 85°C
Input Voltage Range
4.75V to 26V
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device outside of its rated Operating Conditions.
(2)
The maximum allowable power dissipation at any ambient temperature is PMAX = (125 − TA)/θJA, where 125 is the maximum junction
temperature for operation, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is
exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above
150°C, the regulator will go into thermal shutdown. The junction-to-ambient thermal resistance
θJA is 65°C/W, for the TO-220 package,
73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink,
θJA is the sum of the
device junction-to-case thermal resistance
θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the DDPAK/TO-263 or
SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to
the package (see Application Hints for more information on heatsinking).
2
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Product Folder Links: LM2937-2.5 LM2937-3.3


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