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LMX1602 bảng dữ liệu(PDF) 4 Page - Texas Instruments

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OBSOLETE
LMX1600, LMX1601, LMX1602
SNAS017F – MARCH 1998 – REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2) (3)
Value
Parameter
Symbol
Min
Typical
Max
Unit
VCCMAIN
−0.3
6.5
V
Power Supply Voltage
VCCAUX
−0.3
6.5
V
Voltage on any pin with GND=0V
VI
−0.3
VCC + 0.3
V
Storage Temperature Range
TS
−65
+150
°C
Lead Temp. (solder 4 sec)
TL
+260
°C
ESD-Human Body Model(2)
2000
eV
(1)
"Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur. Recommended Operating Conditions
indicate conditions for which the device is intended to be functional, but do not ensure specific performance limits. "Electrical
Characteristics" document specific minimum and/or maximum performance values at specified test conditions and are ensured. Typical
values are for informational purposes only - based on design parameters or device characterization and are not ensured.
(2)
This device is a high performance RF integrated circuit and is ESD sensitive. Handling and assembly of this device should only be done
on ESD-free workstations.
(3)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Recommended Operating Conditions
Value
Parameter
Symbol
Min
Typical
Max
Unit
VCCMAIN
2.7
3.6
V
Power Supply Voltage
VCCAUX
VCCMAIN
VCCMAIN
V
Operating Temperature
TA
−40
+85
°C
4
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Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: LMX1600 LMX1601 LMX1602


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