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MLZ1005MR47WT bảng dữ liệu(PDF) 8 Page - TDK Electronics |
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MLZ1005MR47WT bảng dữ liệu(HTML) 8 Page - TDK Electronics |
8 / 11 page • All specifications are subject to change without notice. 002-06 / 20120514 / e533_mlz (7/10) Inductors for Decoupling Circuits Multilayer/STD • Magnetic Shielded MLZ Series MLZ2012 The MLZ Series is a line of multilayer choke coils for decoupling power circuits. The MLZ2012-W Series, a line of the MLZ Series, has increased its DC superimposition characteristics by up to 250% compared with existing products through the use of TDK's proprietary ferrite material technology. Also available is the MLZ2012-L Series. This series has lowered its resistance by up to 50% compared with existing products through the adoption of a new ferrite material and dense electrodes. This series includes the E6 Series, which handles 1.0 to 15µH, hence it is extremely useful in the power-supply design of low-voltage cir- cuits. FEATURES • The W Series (IDC UP type) is a line of products that have achieved the industry's best DC superimposition characteristics. According to research conducted in August 2010. • The L Series (Low-resistance type) has lowered its resistance by up to 50% compared with existing products. • The D Series (High frequency type) is a line of decoupling coil products for high frequencies. It can handle higher noise frequencies. • With its wider inductance range (0.1 to 47µH) and the addition of the E6 Series, this series can satisfy a wide variety of requirements. APPLICATIONS Modules such as digital cellular phone and camera module, Net- books, note PCs, DSCs, DVCs, video games, portable memory audio devices, navigation systems, PNDs, TVs, W-LANs, solid state drives SPECIFICATIONS RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING PRODUCT IDENTIFICATION (1) Series name (2) Dimensions L W (3) Management symbol (4) Inductance (5) Characteristic type (6) Packaging style (7) TDK internal code PACKAGING STYLE AND QUANTITIES HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the tempera- ture difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • The inductance value may change due to magnetic saturation if the current exceeds the rated maximum. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed cir- cuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. Conformity to RoHS Directive Operating temperature range –55 to +125°C [Including self-temperature rise] Storage temperature range –55 to +125°C(After mount) Natural cooling 10s max. Preheating 60 to 120s Soldering 30 to 60s 230˚C 250 to 260˚C 180˚C 150˚C Time(s) MLZ 2012 A 1R0 W T (1) (2) (3) (4) (5) (6) (7) 2012 2.0 1.25mm R10 0.1 H 1R0 1.0 H 100 10.0 H D High frequency type W IDC-UP type L Low-resistance type T Taping [reel] Packaging style Thickness T(mm) Quantity Taping 0.85 4000 pieces/reel 1.25 2000 pieces/reel • Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. |
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