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TMP141AIDBVR bảng dữ liệu(PDF) 7 Page - Texas Instruments

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Giải thích chi tiết về linh kiện  Digital Out Temperature Sensor with Single-Wire SensorPath Bus
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TMP141
SBAS347A − MARCH 2005 − REVISED JULY 2006
www.ti.com
7
OVERVIEW
The TMP141 is a digital output temperature sensor that
uses the single-wire SensorPath interface protocol. It does
not require any external sensing components for
measuring temperature. In order to minimize circuit board
space, the TMP141 is offered in the MSOP-8 and
SOT23-6 packages.
The primary usage of SensorPath-based systems is for
systems that monitor hardware health. The predefined
SensorPath functions are: temperature measurement,
voltage measurement, and non-volatile memory. The
specification allows for expansion by defining new
functions or enlarging upon the predefined functions. The
TMP141 implements the temperature measurement
function with a resolution of 0.25
°C.
The SensorPath interface allows a master to read up to
seven slave devices on a bus, four of which can be
TMP141s. The master interrogates devices on the bus to
determine what they are, their capabilities, and how they
can be used. Devices on the Single-Wire Data (SWD) bus
are open drain. Therefore, the SWD bus requires a 1.25k
pull-up resistor on the bus. This resistor may be provided
by the master. If the pull-up resistor is not included within
the master, an external resistor must be attached to the
bus. A 0.1
µF capacitor is recommended for power-supply
bypassing, as shown in Figure 3. Registers inside each
device include information that identifies the device
capabilities, manufacturer, part ID, and even device
revision number.
TMP141
Master
Optional
R = 1.25k
SWD
ADD1
ADD0
V
S =3.3V
0.1
µF
V
SS
The resistor R may be
integrated into the master.
Figure 3. Typical Connections of the TMP141
TEMPERATURE SENSING AND
CONVERSION
The TMP141 senses the absolute temperature by utilizing
a diode which is part of the IC. Therefore, the sensing
device of the TMP141 is the chip itself. Thermal paths run
through the package leads as well as the plastic package,
and the lower thermal resistance of metal causes the leads
to provide the primary thermal path.
To maintain accuracy in applications that require air or
surface temperature measurement, care should be taken
that the package and leads thermally connect with the
surface where the temperature measurement is desired.
For example, a thermally-conductive adhesive assists in
achieving accurate surface temperature measurements.
Even without special precautions, because of the very low
power consumption of the TMP141, self-heating will
normally be well below 1LSB (0.25
°C).
TYPICAL APPLICATION
The TMP141 is normally used with the address pins wired
high or low to select one of four possible addresses. The
value read from the hardware pins plus one is stored in
register 0 as the device number. When the master
transmits a matching device number, the TMP141 will
respond. In the example shown in Figure 3, ADD1:ADD0
are wired to 2h. In this example, 3h will be stored in register
0. When the master addresses device number 3, the
TMP141 in Figure 3 will respond. The TMP141 will also
work well in applications where ADD0:ADD1 are driven by
logic levels since it reads these pins every time it does a
conversion or bus transaction (see Table 2).


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