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MCP201TEP bảng dữ liệu(PDF) 3 Page - Microchip Technology |
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3 / 40 page © 2007 Microchip Technology Inc. DS21730F-page 3 MCP201 1.0 DEVICE OVERVIEW The MCP201 provides a physical interface between a microcontroller and a LIN half-duplex bus. It is intended for automotive and industrial applications with serial bus speeds up to 20 Kbaud. The MCP201 provides a half-duplex, bidirectional communications interface between a microcontroller and the serial network bus. This device will translate the CMOS/TTL logic levels to LIN level logic, and vice versa. The LIN specification 1.3 requires that the transceiver of all nodes in the system be connected via the LIN pin, referenced to ground and with a maximum external termination resistance of 510 Ω from LIN bus to battery supply. The 510 Ω corresponds to 1 Master and 16 Slave nodes. The MCP201 provides a +5V 50 mA regulated power output. The regulator uses a LDO design, is short- circuit-protected and will turn the regulator output off if it falls below 3.5V. The MCP201 also includes thermal shutdown protection. The regulator has been specifi- cally designed to operate in the automotive environ- ment and will survive reverse battery connections, +40V load dump transients and double-battery jumps (see Section 1.6 “Internal Voltage Regulator”). 1.1 Optional External Protection 1.1.1 TRANSIENT VOLTAGE PROTECTION (LOAD DUMP) An external 27V transient suppressor (TVS) diode, between VBAT and ground, with a 50 Ω resistor in series with the battery supply and the VBAT pin, serves to pro- tect the device from power transients (see Figure 1-2) and ESD events. While this protection is optional, it should be considered as good engineering practice. 1.1.2 REVERSE BATTERY PROTECTION An external reverse-battery-blocking diode can be used to provide polarity protection (see Figure 1-2). This protection is optional, but should be considered as good engineering practice. 1.2 Internal Protection 1.2.1 ESD PROTECTION For component-level ESD ratings, please refer to the maximum operation specifications. 1.2.2 GROUND LOSS PROTECTION The LIN bus specification states that the LIN pin must transition to the recessive state when ground is disconnected. Therefore, a loss of ground effectively forces the LIN line to a hi-impedance level. 1.2.3 THERMAL PROTECTION The thermal protection circuit monitors the die temperature and is able to shut down the LIN transmitter and voltage regulator. Refer to Table 1-1 for details. There are three causes for a thermal overload. A thermal shut down can be triggered by any one, or a combination of, the following thermal overload conditions. • Voltage regulator overload • LIN bus output overload • Increase in die temperature due to increase in environment temperature Driving the TXD and checking the RXD pin makes it possible to determine whether there is a bus contention (Rx = low, Tx = high) or a thermal overload condition (Rx = high, Tx = low). TABLE 1-1: SOURCES OF THERMAL OVERLOAD(1,2) Note: After recovering from a thermal, bus or voltage regulator overload condition, the device will be in the Ready1 mode. In order to go into Operational mode, the CS/ WAKE pin has to be toggled. TXD RXD Comments L H LIN transmitter shutdown, receiver and voltage regulator active, thermal overload condition. H L Regulator shutdown, receiver active, bus contention. Legend: x = Don’t care, L = Low, H = High Note 1: LIN transceiver overload current on the LIN pin is 200 mA. 2: Voltage regulator overload current on voltage regulator greater than 50 mA. |
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