công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

ADP3335ARMZ-5-REEL bảng dữ liệu(PDF) 11 Page - Analog Devices

tên linh kiện ADP3335ARMZ-5-REEL
Giải thích chi tiết về linh kiện  High Accuracy, Ultralow IQ, 500 mA, anyCAP Low Dropout Regulator
Download  16 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
nhà sản xuất  AD [Analog Devices]
Trang chủ  http://www.analog.com
Logo AD - Analog Devices

ADP3335ARMZ-5-REEL bảng dữ liệu(HTML) 11 Page - Analog Devices

Back Button ADP3335ARMZ-5-REEL Datasheet HTML 7Page - Analog Devices ADP3335ARMZ-5-REEL Datasheet HTML 8Page - Analog Devices ADP3335ARMZ-5-REEL Datasheet HTML 9Page - Analog Devices ADP3335ARMZ-5-REEL Datasheet HTML 10Page - Analog Devices ADP3335ARMZ-5-REEL Datasheet HTML 11Page - Analog Devices ADP3335ARMZ-5-REEL Datasheet HTML 12Page - Analog Devices ADP3335ARMZ-5-REEL Datasheet HTML 13Page - Analog Devices ADP3335ARMZ-5-REEL Datasheet HTML 14Page - Analog Devices ADP3335ARMZ-5-REEL Datasheet HTML 15Page - Analog Devices Next Button
Zoom Inzoom in Zoom Outzoom out
 11 / 16 page
background image
Data Sheet
ADP3335
Rev. D | Page 11 of 16
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
All surface-mount packages rely on the traces of the PC board to
conduct heat away from the package. Use the following general
guidelines when designing printed circuit boards to improve
both electrical and thermal performance.
1. Keep the output capacitor as close as possible to the output
and ground pins.
2. Keep the input capacitor as close as possible to the input
and ground pins.
3. PC board traces with larger cross sectional areas will remove
more heat from the ADP3335. For optimum heat transfer,
specify thick copper and use wide traces.
4. It is not recommended to use solder mask or silkscreen on
the PCB traces adjacent to the ADP3335’s pins, since doing
so will increase the junction-to-ambient thermal resistance
of the package.
5. Use additional copper layers or planes to reduce the thermal
resistance. When connecting to other layers, use multiple
vias, if possible.
LFCSP LAYOUT CONSIDERATIONS
The LFCSP package has an exposed die paddle on the bottom,
which efficiently conducts heat to the PCB. In order to achieve
the optimum performance from the LFCSP package, special
consideration must be given to the layout of the PCB. Use the
following layout guidelines for the LFCSP package.
0.50
2
× VIAS, 0.250∅
35
µm PLATING
3.36
0.90
1.80
2.36
1.90
1.40
0.30
0.73
Figure 25. 3 mm × 3 mm LFCSP Pad Pattern
(Dimensions shown in millimeters)
1. The pad pattern is given in Figure 25. The pad dimension
should be followed closely for reliable solder joints, while
maintaining reasonable clearances to prevent solder
bridging.
2. The thermal pad of the LFCSP package provides a low
thermal impedance path (approximately 20°C/W) to the
PCB. Therefore, the PCB must be properly designed to
effectively conduct heat away from the package. This is
achieved by adding thermal vias to the PCB, which provide
a thermal path to the inner or bottom layers. See Figure 25
for the recommended via pattern. Note that the via diameter
is small to prevent the solder from flowing through the via
and leaving voids in the thermal pad solder joint.
Also, note that the thermal pad is attached to the die substrate,
so the thermal planes to which the thermal vias connect
must be electrically isolated or tied to VIN. Do NOT connect
the thermal pad to ground.
3. The solder mask opening should be about 120 µ (4.7 mils)
larger than the pad size, resulting in a minimum 60 µm
(2.4 mils) clearance between the pad and the solder mask.
4. The paste mask opening is typically designed to match the
pad size used on the peripheral pads of the LFCSP package.
This should provide a reliable solder joint as long as the stencil
thickness is about 0.125 mm. The paste mask for the thermal
pad needs to be designed for the maximum coverage to
effectively remove the heat from the package. However, due
to the presence of thermal vias and the size of the thermal pad,
eliminating voids may not be possible.
5. The recommended paste mask stencil thickness is 0.125 mm.
A laser cut stainless steel stencil with trapezoidal walls should
be used. A “No Clean” Type 3 solder paste should be used
for mounting the LFCSP package. Also, a nitrogen purge
during the reflow process is recommended.
6. The package manufacturer recommends that the reflow
temperature should not exceed 220°C and the time above
liquidus is less than 75 seconds. The preheat ramp should
be 3°C/second or lower. The actual temperature profile
depends on the board density and must be determined by
the assembly house as to what works best.
SHUTDOWN MODE
Applying a TTL high signal to the shutdown (SD) pin or tying it
to the input pin, turns the output ON. Pulling SD down to 0.4 V
or below, or tying it to ground, turns the output OFF. In shutdown
mode, quiescent current is reduced to a typical value of 10 nA.


Số phần tương tự - ADP3335ARMZ-5-REEL

nhà sản xuấttên linh kiệnbảng dữ liệuGiải thích chi tiết về linh kiện
logo
Analog Devices
ADP3335ARMZ-5-REEL AD-ADP3335ARMZ-5-REEL Datasheet
263Kb / 16P
   High Accuracy, Ultralow IQ, 500 mA, anyCAP Low Dropout Regulator
REV. C
ADP3335ARMZ-5-REEL AD-ADP3335ARMZ-5-REEL Datasheet
258Kb / 16P
   High Accuracy, Ultralow IQ, 500 mA, anyCAP Low Dropout Regulator
REV. D
ADP3335ARMZ-5-REEL AD-ADP3335ARMZ-5-REEL Datasheet
258Kb / 16P
   High Accuracy, Ultralow IQ, 500 mA, anyCAP Low Dropout Regulator
REV. D
More results

Mô tả tương tự - ADP3335ARMZ-5-REEL

nhà sản xuấttên linh kiệnbảng dữ liệuGiải thích chi tiết về linh kiện
logo
Analog Devices
ADP3335ARM-3.3 AD-ADP3335ARM-3.3 Datasheet
258Kb / 16P
   High Accuracy, Ultralow IQ, 500 mA, anyCAP Low Dropout Regulator
REV. D
ADP3335 AD-ADP3335 Datasheet
639Kb / 8P
   High Accuracy Ultralow IQ, 500 mA anyCAP Low Dropout Regulator
REV. 0
ADP3335ARM-2.85 AD-ADP3335ARM-2.85 Datasheet
258Kb / 16P
   High Accuracy, Ultralow IQ, 500 mA, anyCAP Low Dropout Regulator
REV. D
ADP3335 AD-ADP3335_12 Datasheet
263Kb / 16P
   High Accuracy, Ultralow IQ, 500 mA, anyCAP Low Dropout Regulator
REV. C
ADP3336 AD-ADP3336 Datasheet
364Kb / 8P
   High Accuracy Ultralow IQ, 500 mA anyCAP Adjustable Low Dropout Regulator
REV. 0
ADP3333 AD-ADP3333_09 Datasheet
245Kb / 12P
   High Accuracy Ultralow IQ, 300 mA, anyCAP Low Dropout Regulator
REV. B
ADP3333 AD-ADP3333 Datasheet
119Kb / 8P
   High Accuracy Ultralow IQ, 300 mA, anyCAP Low Dropout Regulator
REV. 0
ADP3334 AD-ADP3334 Datasheet
230Kb / 8P
   High Accuracy Low IQ, 500 mA anyCAP Adjustable Low Dropout Regulator
REV. 0
ADP3338AKC-18 AD-ADP3338AKC-18 Datasheet
295Kb / 16P
   High Accuracy, Ultralow IQ, 1A, anyCAP Low Dropout Regulator
REV. B
ADP3330ARTZ-2.75R7 AD-ADP3330ARTZ-2.75R7 Datasheet
141Kb / 12P
   High Accuracy Ultralow IQ, 200 mA, SOT-23, anyCAP??Low Dropout Regulator
REV. A
More results


Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16


bảng dữ liệu tải về

Go To PDF Page


Link URL




Chính sách bảo mật
ALLDATASHEET.VN
Cho đến nay ALLDATASHEET có giúp ích cho doanh nghiệp của bạn hay không?  [ DONATE ] 

Alldatasheet là   |   Quảng cáo   |   Liên lạc với chúng tôi   |   Chính sách bảo mật   |   Trao đổi link   |   Tìm kiếm theo nhà sản xuất
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com