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ADP3334ARM bảng dữ liệu(PDF) 9 Page - Analog Devices |
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ADP3334ARM bảng dữ liệu(HTML) 9 Page - Analog Devices |
9 / 12 page REV. B ADP3334 –9– 3. The solder mask opening should be about 120 microns (4.7 mils) larger than the pad size resulting in a minimum 60 micron (2.4 mils) clearance between the pad and the solder mask. 4. The paste mask opening is typically designed to match the pad size used on the peripheral pads of the LFCSP package. This should provide a reliable solder joint as long as the stencil thickness is about 0.125 mm. The paste mask for the thermal pad needs to be designed for the maximum coverage to effectively remove the heat from the package. However, due to the presence of thermal vias and the size of the thermal pad, eliminating voids may not be possible. 5. The recommended paste mask stencil thickness is 0.125 mm. A laser cut stainless steel stencil with trapezoidal walls should be used. A “No Clean” Type 3 solder paste should be used for mount- ing the LFCSP package. Also, a nitrogen purge during the reflow process is recommended. 6. The package manufacturer recommends that the reflow temperature should not exceed 220°C and the time above liquidus is less than 75 seconds. The preheat ramp should be 3°C/second or lower. The actual temperature profile depends on the board density and must determined by the assembly house as to what works best. Use the following general guidelines when designing printed circuit boards. 1. Keep the output capacitor as close as possible to the out- put and ground pins. 2. Keep the input capacitor as close as possible to the input and ground pins. 3. PC board traces with larger cross sectional areas will remove more heat from the ADP3334. For optimum heat transfer, specify thick copper and use wide traces. 4. Use additional copper layers or planes to reduce the thermal resistance. When connecting to other layers, use multiple vias if possible. Shutdown Mode Applying a TTL high signal to the shutdown (SD) pin or the input pin will turn the output off. Pulling SD down to 0.4 V or below or tying it to ground will turn the output on. In shutdown mode, quiescent current is reduced to much less than 1 µA. |
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