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ADG1222BRMZ-REEL71 bảng dữ liệu(PDF) 6 Page - Analog Devices

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ADG1221/ADG1222/ADG1223
Rev. A | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VDD to VSS
35 V
VDD to GND
–0.3 V to +25 V
VSS to GND
+0.3 V to −25 V
Analog Inputs1
VSS – 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Digital Inputs1
GND – 0.3 V to VDD + 0.3 V or
30 mA, whichever occurs first
Peak Current, S or D
100 mA (pulsed at 1 ms,
10% duty cycle max)
Continuous Current per
Channel, S or D
30 mA
Operating Temperature Range
–40°C to +125°C
Storage Temperature Range
–65°C to +150°C
Junction Temperature
150°C
Reflow Soldering Peak
Temperature, Pb free
260°C
1 Overvoltages at IN, S, or D are clamped by internal diodes. Current must be
limited to the maximum ratings given.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
θJC
Unit
10-Lead MSOP (4-Layer Board)
206
44
°C/W
ESD CAUTION


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