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4 / 7 page 4/6 www.rohm.com ○ c 2012 ROHM Co., Ltd. All rights reserved. 2012.11 - Rev.C Data Sheet MCR series - Low Ohmic - < General Purpose > Derating Curve When the ambient temperature exceeds 70°C, power dissipation must be adjusted according to the derating curves below. 0 20 40 60 80 100 −55 0 70 100 125 AMBIENT TEMPERATURE ( °C) MCR006 / 100 Characteristics Guaranteed Value ± (2.0%+0.005Ω) ± (1.0%+0.005Ω) ± (3.0%+0.005Ω) 20 °C No remarkable abnormality on the appearance. A new uniform coating of minimum of 95% of the surface being immersed and no soldering damage. Without Open. Compliance Standard(s) : IEC60115 −8 JISC 5201 −8 Measurement : +20 / −55 / +20 / +125°C Soldering condition : 260 ±5°C Duration of immersion : 10 ±1s 40 °C, 93%RH (Relative Humidity) Test time : 1,000h to 1,048h ± (3.0%+0.005Ω) ± (3.0%+0.005Ω) ± (1.0%+0.005Ω) ※MCR006 only ± (0.5%+0.005Ω) ± (1.0%+0.005Ω) 70 °C Rated voltage (current) 1.5h : ON − 0.5h : OFF Test time : 1,000h to 1,048h 125 °C (MCR006 / 100) 155 °C (MCR01 / 03 / 10 / 18 / 25 / 50) Test time : 1,000h to 1,048h 23 ±5°C, Immersion cleaning, 5±0.5min Solvent : 2 −propanol − Test temp. −55°C to +125°C 100cycle (MCR006) −55°C to +125°C 5cycle (MCR01 / 03 / 10 / 18 / 25 / 50 / 100) Rosin·Ethanol : 25% (weight) Soldering condition : 235 ±5°C Duration of immersion : 2.0 ±0.5s Rated voltage (current) ×2.5, 2s. Maximum overload voltage See "Products List" See "Products List" Test Items Resistance Variation of resistance with temperature Solderability Damp heat, steady state Endurance at 70 °C Endurance Rapid change of temperature Bend strength of the end face plating Resistance to solvent Resistance to soldering heat Overload Test Conditions Chip weight (typical value) Parameter Unit MCR006 YRT MCR01 MRT MCR03 ERT MCR10 EZH MCR18 EZH MCR25 JZH MCR50 JZH MCR100 JZH mg/pc 0.150 0.565 2.03 5.00 9.78 16.5 25.8 42.0 Weight MCR01 / 03 / 10 / 18 / 25 / 50 0 20 40 60 80 100 −55 0 70 100 155 AMBIENT TEMPERATURE ( °C) |
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