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TS61001
Version 1.0
Specifications subject to change
WWW.TRIUNESYSTEMS.COM
Copyright © 2013, Triune Systems, LLC
Triune Systems Proprietary and Confidential Information
DO NOT DUPLICATE
ABSOLUTE MAXIMUM RATINGS
Over operating free–air temperature range unless otherwise noted(1, 2)
Parameter
Value
Unit
VCC, VCCG
13.2
V
VB1, VB2
13.2 (relative to VS1,2)
V
SDATA, SCLK
3.6
V
LS1ON, LS2ON, HS1ON, HS2ON
3.6
V
COMPN, COMPP, AMPN, AMPP, COMPOUT, AMPOUT
3.6
V
Electrostatic Discharge – Human Body Model
+/-2k
V
Electrostatic Discharge – Charge Device Model
+/-500
V
Lead Temperature (soldering, 10 seconds)
260
C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional
operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
THERMAL CHARACTERISTICS
Symbol
Parameter
Value
Unit
JA
Thermal Resistance Junction to Air (Note 1)
34.5
°C/W
JC
Thermal Resistance Junction to Case (Note 1)
2.5
°C/W
TSTG
Storage Temperature Range
-65 to 150
°C
TJ MAX
Maximum Junction Temperature
150
°C
TJ
Operating Junction Temperature Range
-40 to 125
°C
Note 1: Assumes 16LD 3x3 QFN with hi-K JEDEC board and 13.5 inch2 of 1 oz Cu and 4 thermal vias connected to PAD
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Typ
Max
Unit
VCC
Input Operating Voltage
5
12
12.5
V
CBST
Bootstrap Capacitor
100
nF


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