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TS32101 bảng dữ liệu(PDF) 10 Page - List of Unclassifed Manufacturers

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TS32101 bảng dữ liệu(HTML) 10 Page - List of Unclassifed Manufacturers

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Specifications subject to change
WWW.TRIUNESYSTEMS.COM
Copyright © 2012, Triune Systems, LLC
TS32101
Version 2.0
APPLICATION USING A MULTI-LAYER PCB
To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines must be
followed when laying out this part on the PCB.
The following are guidelines for mounting the exposed pad IC on a Multi-Layer PCB with ground a plane.
JEDEC standard FR4 PCB Cross-section:
Multi-Layer Board (Cross-sectional View)
In a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to
the internal ground plane. The efficiency of this method depends on several factors, including die area, number of thermal vias,
thickness of copper, etc.
Package Thermal Pad
Solder Pad (Land Pattern)
Thermal Via's
Package Outline
Package and PCB Land Configuration
For a Multi-Layer PCB
(square)
Package Solder Pad
Package Solder Pad
(bottom trace)
Thermal Via
Component Traces
Thermal Isolation
Power plane only
1.5748mm
0.0 - 0.071 mm Board Base
& Bottom Pad
0.5246 - 0.5606 mm
Power Plane
(1oz Cu)
1.0142 - 1.0502 mm
Ground Plane
(1oz Cu)
1.5038 - 1.5748 mm
Component Trace
(2oz Cu)
2 Plane
4 Plane


Số phần tương tự - TS32101

nhà sản xuấttên linh kiệnbảng dữ liệuGiải thích chi tiết về linh kiện
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Semtech Corporation
TS32101 SEMTECH-TS32101 Datasheet
903Kb / 12P
   High Efficiency DC/DC Boost Converter for USB, 2Mhz
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Mô tả tương tự - TS32101

nhà sản xuấttên linh kiệnbảng dữ liệuGiải thích chi tiết về linh kiện
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TS32101 SEMTECH-TS32101 Datasheet
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