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LM2750SDX-ADJ bảng dữ liệu(PDF) 4 Page - Texas Instruments |
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4 / 24 page LM2750 SNVS180L – APRIL 2002 – REVISED MAY 2013 www.ti.com Thermal Information Junction-to-Ambient Thermal Resistance, WSON-10 Package ( θJA) (1) 55°C/W (1) Junction-to-ambient thermal resistance ( θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC standard JESD51-7. The test board is a 4 layer FR-4 board measuring 102mm x 76mm x 1.6mm with a 2 x 1 array of thermal vias. The ground plane on the board is 50mm x 50mm. Thickness of copper layers are 36µm/18µm /18µm/36µm(1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1W. The value of θJA of the LM2750 in WSON-10 could fall in a range as wide as 50ºC/W to 150ºC/W (if not wider), depending on PCB material, layout, and environmental conditions. In applications where high maximum power dissipation exists (high VIN, high IOUT), special care must be paid to thermal dissipation issues. For more information on these topics, see TI's AN-1187 Application Report (SNOA401) and the LAYOUT RECOMMENDATIONS section of this datasheet. Electrical Characteristics (1) (2) Typical values and limits in standard typeface apply for TJ = 25ºC. Limits in boldface type apply over the operating junction temperature range. Unless otherwise specified: 2.9V ≤ VIN ≤ 5.6V, VOUT = 5.0V (LM2750-ADJ), V(SD) = VIN, CFLY = 1µF, CIN = 2 x 1µF, COUT = 2 x 1µF (3). Symbol Parameter Conditions Min Typ Max Units 2.9V ≤ VIN ≤ 5.6V, 4.80 5.0 5.20 IOUT ≤ 120mA (-4%) (+4%) Output Voltage V VOUT (LM2750-5.0) (%) 2.7V ≤ VIN ≤ 2.9V, 4.80 5.0 5.20 IOUT ≤ 40mA (-4%) (+4%) IQ Operating Supply Current IOUT = 0mA, 5 10 mA VIH(MIN) ≤ V(SD) ≤VIN 12 ISD Shutdown Supply Current V(SD) = 0V 2 µA VFB Feedback Pin Voltage (LM2750- VIN = 3.1V 1.170 1.232 1.294 V ADJ) IFB Feedback Pin Input Current VFB = 1.4V 1 nA (LM2750-ADJ) VR Output Ripple COUT = 10µF, IOUT = 100mA 4 mVp-p COUT = 2.2µF, IOUT = 100mA 15 EPEAK Peak Efficiency VIN = 2.7V, IOUT = 40mA 87 % (LM2750-5.0) VIN = 2.9V, IOUT = 120mA 85 EAVG Average Efficiency over Li-Ion Input VIN Range: 2.9V - 4.2V, 70 % Range IOUT = 120mA (LM2750-5.0) (4) VIN Range: 2.9V - 4.2V, 67 IOUT = 40mA fSW Switching Frequency 1.0 1.7 MHz tON VOUT Turn-On Time VIN= 3.0V, IOUT = 100mA, 0.5 ms (5) ILIM Current Limit VOUT shorted to GND 300 mA Shutdown Pin (SD) Characteristics VIH Logic-High SD Input 1.3 VIN V VIL Logic-Low SD Input 0 0.4 V IIH SD Input Current (6) 1.3V ≤ V(SD) ≤ VIN 15 50 µA IIL SD Input Current V(SD) = 0V −1 1 µA (1) All voltages are with respect to the potential at the GND pin. (2) Min and Max limits are specified by design, test, or statistical analysis. Typical numbers represent the most likely norm. (3) CFLY, CIN, and COUT : Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics (4) Efficiency is measured versus VIN, with VIN being swept in small increments from 3.0V to 4.2V. The average is calculated from these measurements results. Weighting to account for battery voltage discharge characteristics (VBAT vs. Time) is not done in computing the average. (5) Turn-on time is measured from when SD signal is pulled high until the output voltage crosses 90% of its final value. (6) SD Input Current (IIH ) is due to a 200kΩ (typ.) pull-down resistor connected internally between the SD pin and GND. 4 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LM2750 |
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