Analog Integrated Circuit Device Data

Freescale Semiconductor

5

34932

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 2. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device. These parameters are not production tested.

Ratings

Symbol

Value

Unit

ELECTRICAL RATINGS

Power Supply Voltage

Normal Operation (Steady-state)

Transient Overvoltage(1)

-0.3 to 28

-0.3 to 40

V

Logic Input Voltage(2)

-0.3 to 7.0

V

SFA

, SFB Output(3)

-0.3 to 7.0

V

Continuous Output Current(4)

5.0

A

ESD Voltage(5)

Human Body Model

Machine Model

Charge Device Model

Corner Pins

All Other Pins

±2000

±200

±750

±500

V

THERMAL RATINGS

Storage Temperature

- 65 to 150

Operating Temperature(6)

Ambient

Junction

-40 to 85

-40 to 150

Peak Package Reflow Temperature During Reflow(7), (8)

Note 8

°C

Approximate Junction-to Case Thermal Resistance(9)

<1.0

Notes

1.

protection is required to prevent device damage in case of a reverse power condition.

2.

Exceeding the maximum input voltage on IN1, IN2, IN3, IN4, EN/D2, EN/D4, D1, or D3 may cause a malfunction or permanent damage

to the device.

3.

Exceeding the pull-up resistor voltage on the open drain SFA or SFB pin may cause permanent damage to the device.

4.

Continuous output current capability is dependent on sufficient package heatsinking to keep junction temperature

≤150

5.

6.

The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking provided. Brief

non-repetitive excursions of junction temperature above 150

maximum. (Non-repetitive events are defined as not occurring more than once in 24 hours.)

7.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

8.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

9.

values varies depending on solder thickness and composition and copper trace thickness and area. Maximum current at maximum die

<5.0

°C/W for maximum current at 70 °C ambient. Module thermal design must be planned accordingly.