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MC34931 bảng dữ liệu(PDF) 5 Page - Freescale Semiconductor, Inc |
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MC34931 bảng dữ liệu(HTML) 5 Page - Freescale Semiconductor, Inc |
5 / 25 page Analog Integrated Circuit Device Data Freescale Semiconductor 5 34931 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground, unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. These parameters are not production tested. Ratings Symbol Value Unit ELECTRICAL RATINGS Power Supply Voltage Normal Operation (Steady-state) Transient Overvoltage(1) VPWR(SS) VPWR(T) -0.3 to 28 -0.3 to 40 V Logic Input Voltage(2) VIN -0.3 to 7.0 V SF Output(3) V SF -0.3 to 7.0 V Continuous Output Current(4) IOUT(CONT) 5.0 A ESD Voltage(5) Human Body Model Machine Model Charge Device Model Corner Pins All Other Pins VESD1 VESD2 ±2000 ±200 ±750 ±500 V THERMAL RATINGS Storage Temperature TSTG - 65 to 150 °C Operating Temperature(6) Ambient Junction TA TJ -40 to 85 -40 to 150 °C Peak Package Reflow Temperature During Reflow(7),(8) TPPRT Note 8 °C Approximate Junction-to-Case Thermal Resistance (9) RθJC <1.0 °C/W Notes 1. Device survives repetitive transient overvoltage conditions for durations not to exceed 500 ms @ duty cycle not to exceed 5.0%. External protection is required to prevent device damage in case of a reverse power condition. 2. Exceeding the maximum input voltage on IN1, IN2, EN/D2 or D1 may cause a malfunction or permanent damage to the device. 3. Exceeding the pull-up resistor voltage on the open drain SF pin may cause permanent damage to the device. 4. Continuous output current capability is dependent on sufficient package heatsinking to keep junction temperature ≤150 °C. 5. ESD testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω), Machine Model (CZAP = 200 pF, RZAP = 0 Ω), and the Charge Device Model (CDM), Robotic (CZAP = 4.0 pF). 6. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking provided. Brief non-repetitive excursions of junction temperature above 150 °C can be tolerated, provided the duration does not exceed 30 seconds maximum. (Non-repetitive events are defined as not occurring more than once in 24 hours.) 7. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 8. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. 9. Exposed heatsink pad plus the power and ground pins comprise the main heat conduction paths. The actual RθJB (junction-to-PC board) values varies depending on solder thickness and composition and copper trace thickness and area. Maximum current at maximum die temperature represents ~16 W of conduction loss heating in the diagonal pair of output MOSFETs. Therefore, the RθJA must be <5.0 °C/W for maximum current at 70 °C ambient. Module thermal design must be planned accordingly. |
Số phần tương tự - MC34931 |
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Mô tả tương tự - MC34931 |
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