MC74VHC1G03DFT2G datasheet(2/6 Pages) ONSEMI

tên linh kiện	MC74VHC1G03DFT2G

Giải thích chi tiết về linh kiện	Single 2?묲nput NOR Gate with Open Drain Output

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MC74VHC1G03

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MAXIMUM RATINGS

Symbol

Characteristics

Value

Unit

VCC

DC Supply Voltage

−0.5 to +7.0

V

VIN

DC Input Voltage

−0.5 to +7.0

V

VOUT

DC Output Voltage

VCC = 0

High or Low State

−0.5 to 7.0

−0.5 to VCC + 0.5

V

IIK

Input Diode Current

−20

mA

IOK

Output Diode Current

VOUT < GND; VOUT > VCC

+20

mA

IOUT

DC Output Current, per Pin

+25

mA

ICC

DC Supply Current, VCC and GND

+50

mA

PD

Power Dissipation in Still Air at 85

°C

SC70−5/SC−88A

TSOP−5

150

200

mW

qJA

Thermal Resistance

SC70−5/SC−88A (Note 1)

TSOP−5

350

230

°C/W

TL

Lead Temperature, 1 mm from Case for 10 Seconds

260

°C

TJ

Junction Temperature Under Bias

)150

°C

TSTG

Storage Temperature Range

*65 to )150

°C

MSL

Moisture Sensitivity

Level 1

FR

Flammability Rating

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

VESD

ESD Withstand Voltage

Human Body Model (Note 2)

Machine Model (Note 3)

Charged Device Model (Note 4)

> 2000

> 200

N/A

V

ILATCHUP

Latchup Performance

Above VCC and Below GND at 125°C (Note 5)

$500

mA

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.

2. Tested to EIA/JESD22−A114−A.

3. Tested to EIA/JESD22−A115−A.

4. Tested to JESD22−C101−A.

5. Tested to EIA/JESD78.

RECOMMENDED OPERATING CONDITIONS

Symbol

Characteristics

Min

Max

Unit

VCC

DC Supply Voltage

2.0

5.5

V

VIN

DC Input Voltage

0.0

5.5

V

VOUT

DC Output Voltage

0.0

7.0

V

TA

Operating Temperature Range

−55

+125

°C

tr, tf

Input Rise and Fall Time

VCC = 3.3 V ± 0.3 V

VCC = 5.0 V ± 0.5 V

0

100

20

ns/V

DEVICE JUNCTION TEMPERATURE VERSUS

TIME TO 0.1% BOND FAILURES

Junction

Temperature

°C

Time, Hours

Time, Years

80

1,032,200

117.8

90

419,300

47.9

100

178,700

20.4

110

79,600

9.4

120

37,000

4.2

130

17,800

2.0

140

8,900

1.0

1

10

100

1000

FAILURE RATE OF PLASTIC = CERAMIC

UNTIL INTERMETALLICS OCCUR

Figure 3. Failure Rate vs. Time Junction Temperature

TIME, YEARS

Số phần tương tự - MC74VHC1G03DFT2G

nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
ON Semiconductor	MC74VHC1G03DFT2G	207Kb / 14P	Single 2-Input NOR Gate November, 2018 ??Rev. 15
	MC74VHC1G03DFT2G	171Kb / 14P	Single 2-Input NOR Gate with Open Drain Output April, 2022 ??Rev. 17
	MC74VHC1G03DFT2G-L22038	171Kb / 14P	Single 2-Input NOR Gate with Open Drain Output April, 2022 ??Rev. 17

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Mô tả tương tự - MC74VHC1G03DFT2G

nhà sản xuất	tên linh kiện	bảng dữ liệu	Giải thích chi tiết về linh kiện
ON Semiconductor	MC74VHC1G09	79Kb / 6P	2?묲nput AND Gate with Open Drain Output January, 2007 ??Rev. 16
	MC74VHC1G03	171Kb / 14P	Single 2-Input NOR Gate with Open Drain Output April, 2022 ??Rev. 17
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	MC74VHC1G02DTT1G	65Kb / 6P	Single 2?묲nput NOR Gate January, 2007 ??Rev. 17
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