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4 / 24 page 4 FN8085.8 September 12, 2008 Absolute Maximum Ratings Thermal Information Voltage on VDD, VBAT, SCL, SDA, and IRQ Pins (Note 3) (respect to GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V Voltage on X1 and X2 Pins (respect to GND) . . . . . . . . . . . . . -0.5V to VDD + 0.5 (VDD Mode) -0.5V to VBAT + 0.5 (VBAT Mode) Latchup (Note 4) ................Class II, Level B @ +85°C Thermal Resistance (Typical, Note 1) θJA (°C/W) θJC (°C/W) SOIC Package . . . . . . . . . . . . . . . . . . . 95 N/A MSOP Package . . . . . . . . . . . . . . . . . . 128 N/A TDFN Package (Note 2). . . . . . . . . . . . 53.7 2.8 Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 1. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 2. For θ JC, the “case temp” location is the center of the exposed metal pad on the package underside. 3. The VDD and SDA pins should not be subjected to negative voltage while the VBAT pin is biased, otherwise latchup can result. See the Applications section. 4. Jedec Class II pulse conditions and failure criterion used. Level B exceptions are using a negative pulse limited to -0.5V. DC Operating Characteristics – RTC Temperature = -40°C to +85°C, unless otherwise stated. SYMBOL PARAMETER CONDITIONS NOTES MIN (Note 9) TYP (Note 8) MAX (Note 9) UNITS VDD Main Power Supply 2.7 5.5 V VBAT Battery Supply Voltage 1.8 5.5 V IDD1 Supply Current VDD = 5V 5, 6 2 6 µA VDD = 3V 1.2 4 µA IDD2 Supply Current With I2C Active VDD = 5V 5, 6 40 120 µA IDD3 Supply Current (Low Power Mode) VDD = 5V, LPMODE = 1 5 1.4 5 µA IBAT Battery Supply Current VBAT = 3V 5 400 950 nA ILI Input Leakage Current on SCL 100 nA ILO I/O Leakage Current on SDA 100 nA VTRIP VBAT Mode Threshold 1.6 2.2 2.6 V VTRIPHYS VTRIP Hysteresis 10 30 75 mV VBATHYS VBAT Hysteresis 15 50 100 mV IRQ/FOUT VOL Output Low Voltage VDD = 5V IOL = 3mA 0.4 V VDD = 2.7V IOL = 1mA 0.4 V Power-Down Timing Temperature = -40°C to +85°C, unless otherwise stated. SYMBOL PARAMETER CONDITIONS NOTES MIN (Note 9) TYP (Note 8) MAX (Note 9) UNITS VDD SR- VDD Negative Slewrate 7 10 V/ms Serial Interface Specifications Over the recommended operating conditions unless otherwise specified. SYMBOL PARAMETER TEST CONDITIONS NOTES MIN (Note 9) TYP (Note 8) MAX (Note 9) UNITS SERIAL INTERFACE SPECS VIL SDA and SCL Input Buffer LOW Voltage -0.3 0.3 x VDD V ISL1208 |
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