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2N103D175 bảng dữ liệu(PDF) 6 Page - Littelfuse

tên linh kiện 2N103D175
Giải thích chi tiết về linh kiện  Teccor brand Thyristors 0.8 Amp Sensitive SCRs
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2N103D175 bảng dữ liệu(HTML) 6 Page - Littelfuse

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168
Revised: June 21, 2011 04:14 PM
©2011 Littelfuse, Inc
Teccor® brand Thyristors
Specifications are subject to change without notice.
Please refer to http://www.littelfuse.com for current information.
0.8 Amp Sensitive SCRs
EC103xx & SxSx Series
Soldering Parameters
Reflow Condition
Pb – Free assembly
Pre Heat
-Temperature Min (T
s(min))
150°C
-Temperature Max (T
s(max))
200°C
-Time (min to max) (t
s)
60 – 180 secs
Average ramp up rate (LiquidusTemp)
(T
L) to peak
5°C/second max
T
S(max) to TL - Ramp-up Rate
5°C/second max
Reflow
-Temperature (T
L) (Liquidus)
217°C
-Temperature (t
L)
60 – 150 seconds
PeakTemperature (T
P)
260+0/-5 °C
Time within 5°C of actual peak
Temperature (t
p)
20 – 40 seconds
Ramp-down Rate
5°C/second max
Time 25°C to peakTemperature (T
P)
8 minutes Max.
Do not exceed
280°C
Physical Specifications
Environmental Specifications
Test
Specifications and Conditions
AC Blocking
MIL-STD-750, M-1040, Cond A Applied
Peak AC voltage @ 110°C for 1008 hours
Temperature Cycling
MIL-STD-750, M-1051,
100 cycles; -40°C to +150°C; 15-min
dwell-time
Temperature/
Humidity
EIA / JEDEC, JESD22-A101
1008 hours; 320V - DC: 85°C; 85%
rel humidity
High Temp Storage
MIL-STD-750, M-1031,
1008 hours; 150°C
Low-Temp Storage
1008 hours; -40°C
Thermal Shock
MIL-STD-750, M-1056
10 cycles; 0°C to 100°C; 5-min dwell-
time at each temperature; 10 sec (max)
transfer time between temperature
Autoclave
EIA / JEDEC, JESD22-A102
168 hours (121°C at 2 ATMs) and
100% R/H
Resistance to
Solder Heat
MIL-STD-750 Method 2031
Solderability
ANSI/J-STD-002, category 3, Test A
Lead Bend
MIL-STD-750, M-2036 Cond E
Terminal Finish
100% Matte Tin-plated/Pb-free Solder
Dipped
Body Material
UL recognized epoxy meeting flammability
classification 94V-0
Lead Material
Copper Alloy
Design Considerations
Careful selection of the correct device for the application’s
operating parameters and environment will go a long way
toward extending the operating life of the Thyristor. Good
design practice should limit the maximum continuous
current through the main terminals to 75% of the device
rating. Other ways to ensure long life for a power discrete
semiconductor are proper heat sinking and selection of
voltage ratings for worst case conditions. Overheating,
overvoltage (including dv/dt), and surge currents are
the main killers of semiconductors. Correct mounting,
soldering, and forming of the leads also help protect
against component damage.
Time
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
Preheat
Ramp-up
Ramp-up
Ramp-down
Ramp-do


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