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MC17XSF500EK bảng dữ liệu(PDF) 10 Page - Freescale Semiconductor, Inc |
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MC17XSF500EK bảng dữ liệu(HTML) 10 Page - Freescale Semiconductor, Inc |
10 / 70 page Analog Integrated Circuit Device Data 10 Freescale Semiconductor MC17XSF500 4.3 Thermal Characteristics 4.4 Operating Conditions This section describes the operating conditions of the device. Conditions apply to all the following data, unless otherwise noted. Table 4. Thermal Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Symbol Description (Rating) Min. Max. Unit Notes THERMAL RATINGS TA TJ Operating Temperature • Ambient • Junction -40 -40 +125 +150 °C (7) TSTG Storage Temperature -55 +150 °C TPPRT Peak Package Reflow Temperature During Reflow – 260 °C (8) (9) THERMAL RESISTANCE AND PACKAGE DISSIPATION RATINGS RJB Junction-to-Board ([1]Soldered to Board) – 2.5 °C/W (10) RJA Junction-to-Ambient, Natural Convection, Four-layer Board (2s2p) – 19.4 °C/W (11) (12) RJC Junction-to-Case (Case top surface) – 14.2 °C/W (13) Notes 7. To achieve high reliability over 10 years of continuous operation, the device's continuous operating junction temperature should not exceed 125 C. 8. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 9. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. 10. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 11. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 12. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal. 13. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1). Table 5. Operating Conditions All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Symbol Ratings Min Max Unit Notes VPWR Functional operating supply voltage - Device is fully functional. All features are operating. 7.0 18 V Over voltage range • Jump Start • Load dump – – 28 40 V Reverse Supply -16 – V VCC Functional operating supply voltage - Device is fully functional. All features are operating. 4.5 5.5 V |
Số phần tương tự - MC17XSF500EK |
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Mô tả tương tự - MC17XSF500EK |
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