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MC17XSF500EK bảng dữ liệu(PDF) 10 Page - Freescale Semiconductor, Inc

tên linh kiện MC17XSF500EK
Giải thích chi tiết về linh kiện  Penta 17 mOhm High Side Switch
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nhà sản xuất  FREESCALE [Freescale Semiconductor, Inc]
Trang chủ  http://www.freescale.com
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MC17XSF500EK bảng dữ liệu(HTML) 10 Page - Freescale Semiconductor, Inc

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Analog Integrated Circuit Device Data
10
Freescale Semiconductor
MC17XSF500
4.3
Thermal Characteristics
4.4
Operating Conditions
This section describes the operating conditions of the device. Conditions apply to all the following data, unless otherwise noted.
Table 4. Thermal Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Symbol
Description (Rating)
Min.
Max.
Unit
Notes
THERMAL RATINGS
TA
TJ
Operating Temperature
• Ambient
• Junction
-40
-40
+125
+150
°C
(7)
TSTG
Storage Temperature
-55
+150
°C
TPPRT
Peak Package Reflow Temperature During Reflow
260
°C
(8) (9)
THERMAL RESISTANCE AND PACKAGE DISSIPATION RATINGS
RJB
Junction-to-Board ([1]Soldered to Board)
2.5
°C/W
(10)
RJA
Junction-to-Ambient, Natural Convection, Four-layer Board (2s2p)
19.4
°C/W
(11) (12)
RJC
Junction-to-Case (Case top surface)
14.2
°C/W
(13)
Notes
7.
To achieve high reliability over 10 years of continuous operation, the device's continuous operating junction temperature should not
exceed 125
C.
8.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
9.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
10.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top
surface of the board near the package.
11.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
12.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
13.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
Table 5. Operating Conditions
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Symbol
Ratings
Min
Max
Unit
Notes
VPWR
Functional operating supply voltage - Device is fully
functional. All features are operating.
7.0
18
V
Over voltage range
• Jump Start
• Load dump
28
40
V
Reverse Supply
-16
V
VCC
Functional operating supply voltage - Device is fully
functional. All features are operating.
4.5
5.5
V


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