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LM4819MX bảng dữ liệu(PDF) 3 Page - Texas Instruments |
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LM4819MX bảng dữ liệu(HTML) 3 Page - Texas Instruments |
3 / 27 page LM4819, LM4819MBD www.ti.com SNAS133D – FEBRUARY 2001 – REVISED MARCH 2013 Absolute Maximum Ratings (1) (2) (3) Supply Voltage 6.0V Storage Temperature −65°C to +150°C Input Voltage −0.3V to VDD +0.3V Power Dissipation (PD) (4) Internally Limited ESD Susceptibility(5) 3.5kV ESD Susceptibility(6) 250V Junction Temperature (TJ) 150°C Soldering Information Small Outline Package Vapor Phase (60 seconds) 215°C Infrared (15 seconds) 220°C Thermal Resistance θJC (VSSOP) 56°C/W θJA (VSSOP) 210°C/W θJC (SOIC) 35°C/W θJA (SOIC) 170°C/W θJA (WSON) 117°C/W(7) θJA (WSON) 150°C/W(8) (1) All voltages are measured with respect to the ground pin, unless otherwise specified. (2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not ensured for parameters where no limit is given. However, the typical value is a good indication of device's performance. (3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. (4) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature TA. The maximum allowable power dissipation is PDMAX = (TJMAX–TA)/θJA. For the LM4819, TJMAX = 150°C and the typical junction-to- ambient thermal resistance ( θJA) when board mounted is 210°C/W for the VSSOP package and 170°C/W for the SOIC package. (5) Human body model, 100pF discharged through a 1.5 k Ω resistor. (6) Machine Model, 220pF–240pF capacitor is discharged through all pins. (7) The given θJA is for an LM4819 package in an NGL0008B with the Exposed-DAP soldered to a printed circuit board copper pad with an area equivalent to that of the Exposed-DAP itself. The Exposed-DAP of the NGL0008B package should be electrically connected to GND or an electrically isolated copper area. (8) The given θJA is for an LM4819 package in an NGL0008B with the Exposed-DAP not soldered to any printed circuit board copper. Operating Ratings (1) (2) Temperature Range −40°C ≤ TA ≤ 85°C TMIN ≤ TA ≤ TMAX Supply Voltage 2.0V ≤ VCC ≤ 5.5V (1) All voltages are measured with respect to the ground pin, unless otherwise specified. (2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not ensured for parameters where no limit is given. However, the typical value is a good indication of device's performance. Copyright © 2001–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM4819 LM4819MBD |
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