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AD9963BCPZ bảng dữ liệu(PDF) 8 Page - Analog Devices

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Giải thích chi tiết về linh kiện  10-/12-Bit, Low Power, Broadband MxFE
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AD9961/AD9963
Data Sheet
Rev. A | Page 8 of 60
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
With
Respect to
Rating
RX33V, AUX33V
RXGND
−0.3 V to +3.9 V
TXVDD
TXGND
−0.3 V to +3.9 V
DRVDD
DGND
−0.3 V to +3.9 V
CLK33V
EPAD
−0.3 V to +3.9 V
RX18V, RX18VF
RXGND
−0.3 to +2.1 V
DVDD18V
EPAD
−0.3 to +2.1 V
CLK18V, DLL18V
EPAD
−0.3 to +2.1 V
RXGND, TXGND, DGND,
EPAD
−0.3 V to +0.3 V
TXIP, TXIN, TXQP, TXQN
TXGND
−1.0 V to TXVDD +
0.3 V
RXIP, RXIN, RXQP, RXQN
RXGND
−0.3 V to RX18V +
0.3 V
CS, SCLK, SDIO, RESET,
LDO_EN
DGND
−0.3V to DRVDD +
0.3 V
TRXD[11:0], TXD[11:0], TXIQ,
TRXIQ, TXCLK, TRXCLK
DGND
−0.3 V to DRVDD +
0.3 V
CLKP, CLKN
EPAD
−0.3 V to CLK33V +
0.3 V
Junction Temperature
+125°C
Storage Temperature Range
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the
customer board increases the reliability of the solder joints,
maximizing the thermal capability of the package.
Table 7. Thermal Resistance
Airflow
θ
JA
θ
JB
θ
JC
Unit
1 m/sec
17.1
10.6
1.0
°C/W
0 m/sec
20.3
°C/W
Typical θJA, θJB, and θJC are specified for a JEDEC standard 51-7
High-κ thermal test board. Airflow increases heat dissipation,
effectively reducing θJA. In addition, metal in direct contact with
the package leads from metal traces, through holes, ground, and
power planes, reduces the θJA.
ESD CAUTION


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