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AD9142 bảng dữ liệu(PDF) 9 Page - Analog Devices

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Data Sheet
AD9142
Rev. 0 | Page 9 of 64
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
Rating
AVDD33 to AVSS, EPAD, CVSS, DVSS
−0.3 V to +3.6 V
DVDD18, CVDD18 to AVSS, EPAD,
CVSS, DVSS
−0.3 V to +2.1 V
AVSS to EPAD, CVSS, DVSS
−0.3 V to +0.3 V
EPAD to AVSS, CVSS, DVSS
−0.3 V to +0.3 V
CVSS to AVSS, EPAD, DVSS
−0.3 V to +0.3 V
DVSS to AVSS, EPAD, CVSS
−0.3 V to +0.3 V
FSADJ, REFIO, IOUT1P/IOUT1N,
IOUT2P/IOUT2N to AVSS
−0.3 V to AVDD33 + 0.3 V
D[15:0]P/D[15:0]N, FRAMEP/FRAMEN,
DCIP/DCIN to EPAD, DVSS
−0.3 V to DVDD18 + 0.3 V
DACCLKP/DACCLKN,
REFP/SYNCP/REFN/SYNCN to CVSS
−0.3 V to CVDD18 + 0.3 V
RESET, IRQ1, IRQ2, CS, SCLK, SDIO
to EPAD, DVSS
−0.3 V to DVDD18 + 0.3 V
Junction Temperature
125°C
Storage Temperature Range
−65°C to +150°C
THERMAL RESISTANCE
The exposed pad (EPAD) must be soldered to the ground plane
(AVSS) for the 72-lead LFCSP. The EPAD provides an electrical,
thermal, and mechanical connection to the board.
Typical θJA, θJB, and θJC values are specified for a 4-layer board in
still air. Airflow increases heat dissipation, effectively reducing
θJA and θJB.
Table 8. Thermal Resistance
Package
θJA
θJB
θJC
Unit
Conditions
72-Lead LFCSP
20.7
10.9
1.1
°C/W
EPAD soldered
to ground plane
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.


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