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LM2751 bảng dữ liệu(PDF) 3 Page - Texas Instruments |
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LM2751 bảng dữ liệu(HTML) 3 Page - Texas Instruments |
3 / 19 page LM2751 www.ti.com SNVS299B – APRIL 2005 – REVISED MAY 2013 ABSOLUTE MAXIMUM RATINGS (1) (2) (3) VIN Pin −0.3V to 6.0V EN, CS0, CS1 Pins −0.3V to (VIN+0.3) w/ 6.0V max Continuous Power Dissipation(4) Internally Limited Junction Temperature (TJ-MAX-ABS) 150°C Storage Temperature Range −65°C to 150°C Maximum Lead Temperature (Soldering, 10sec.) 265°C ESD Rating(5) Human-body model 2kV Machine model 200V (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is specified. Operating Ratings do not imply ensured performance limits. For specified performance limits and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are with respect to the potential at the GND pin. (3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (4) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ=150°C (typ.) and disengages at TJ=140°C (typ.). (5) The Human body model is a 100 pF capacitor discharged through a 1.5k Ω resistor into each pin. The machine model is a 200pF capacitor discharged directly into each pin (MIL-STD-883 3015.7). OPERATING RATINGS (1) (2) Input Voltage Range 2.8V to 5.5V EN, CS0, CS1 Input Voltage Range 0V to VIN Junction Temperature (TJ) Range -40°C to 115°C Ambient Temperature (TA) Range (3) -40°C to 85°C Recommended Maximum Load Current Version B Freq. = 725kHz 150mA Freq. = 300kHz 120mA Freq. = 37kHz 40mA Freq. = 9.5kHz 10mA Version A Freq. = 725kHz 80mA Freq. = 300kHz 60mA Freq. = 37kHz 16mA Freq. = 9.5kHz 4mA (1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is specified. Operating Ratings do not imply ensured performance limits. For specified performance limits and associated test conditions, see the Electrical Characteristics tables. (2) All voltages are with respect to the potential at the GND pin. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operation junction temperature (TJ-MAX-OP = 115ºC), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA-MAX = TJ-MAX-OP - (θJA × PD-MAX). THERMAL PROPERTIES Junction-to-Ambient Thermal Package ( θJA) (1) Resistance, 10-pin SON 55°C/W (1) Junction-to-ambient thermal resistance ( θJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC standard JESD51-7. The test board is a 4 layer FR-4 board measuring 102mm x 76mm x 1.6mm with a 2 x 1 array of thermal vias. The ground plane on the board is 50mm x 50mm. Thickness of copper layers are 36µm/18µm /18µm/36µm(1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22ºC, still air. Power dissipation is 1W. The value of θJA of the LM2751 in 10-pin SON could fall in a range as wide as 50ºC/W to 150ºC/W (if not wider), depending on PWB material, layout, and environmental conditions. In applications where high maximum power dissipation exists (high VIN, high IOUT), special care must be paid to thermal dissipation issues. For more information on these topics, see the TI AN-1187 Application Report (SNOA401) and the Power Efficiency and Power Dissipation section of this datasheet. Copyright © 2005–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM2751 |
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