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LM98555 bảng dữ liệu(PDF) 7 Page - Texas Instruments |
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LM98555 bảng dữ liệu(HTML) 7 Page - Texas Instruments |
7 / 15 page Vias couple thermal energy to internal ground planes and heat spreader pad on bottom layer to transfer heat away from package. Vias couple thermal energy to internal ground plane to transfer heat away from package. 3.81 mm 5.81 mm Vias are 0.3 mm diameter at 1.2 mm pitch. Recommended via plating of 1 oz copper. Exposed thermal pad mounting area. LM98555 www.ti.com SNAS290D – DECEMBER 2005 – REVISED APRIL 2013 APPLICATION INFORMATION The LM98555 is a fully integrated clock driver/buffer for high speed CCD applications. It provides high performance low impedance drivers, with optimized low skew performance of the P1 and P2 outputs. Enable inputs allow use of two, four, six, or all eight P1 and P2 drivers to optimize the amount of drive for the application. The 64 pin thermally enhanced HTSSOP provides excellent power handling through the use of an exposed heat transfer pad on the underside of the package. THERMAL GUIDELINES The LM98555's maximum power dissipation limit, shown in Operating Conditions, must be strictly adhered to. The product's multiple high-strength drivers, with their ability to drive a wide-range of loads, make it possible to be within spec on each output and yet violate the aggregate maximum power dissipation limit for the total product. Special caution must be paid to this by limiting the chip's operating conditions (loads, power supply, number of parallel drivers enabled, frequency of operation) to make certain that the maximum power dissipation limit is never exceeded. Thermal characterization of the device has been done to provide reference points under specific conditions. θ junction to ambient was measured using a 5.5 inch by 3 inch, 4 layer PCB. The thermal contact pad on the board was connected using vias to a full ground plane on one of the internal layers. The recommended thermal pad is shown in Figure 4. Figure 4. Exposed Pad Land Pattern The vias shown provide a path for heat to flow from the pad to a heat sinking or dissipating area of the printed circuit board. The following figures show several typical examples of how this can be done, and illustrate how heat is conducted away from the IC to larger areas where it is dissipated. Figure 5. 4 Layer PCB - Example 1 Figure 6. 4 Layer PCB - Example 2 Copyright © 2005–2013, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: LM98555 |
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