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LMZ12010 bảng dữ liệu(PDF) 3 Page - Texas Instruments |
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LMZ12010 bảng dữ liệu(HTML) 3 Page - Texas Instruments |
3 / 29 page PGND/EP Connect to AGND 5 AGND 6 AGND 3 AGND 1 VIN 2 VIN 4 EN 7 FB SS 9 NC 10 VOUT 11 VOUT 8 VIN CIN 3 x 10 PF RFBT CFF 4.7 nF (OPT) See Table CSS 0.47 PF (OPT) RFBB See Table COUT 2 x 330 PF LMZ12010 VOUT 5V 5.62k 1.07k 7...20V VOUT RFBT RFBB VIN Range 3.3V 3.32k 1.07k 6...20V 2.5V 2.26k 1.07k 6...20V 1.8V 1.87k 1.50k 6...20V 1.5V 1.00k 1.13k 6...20V 1.2V 1.07k 2.05k 6...20V 0.8V 0 4.02k 6...20V 6V 15.4k 2.37k 8.5...20V 1.0V 1.62k 6.49k 6...20V Enable LMZ12010 www.ti.com SNVS667F – FEBRUARY 2010 – REVISED MARCH 2013 Simplified Application Schematic Connection Diagram Figure 5. Top View 11-Lead PFM Pin Descriptions Pin Name Description 1, 2 VIN Input supply — Nominal operating range is 6V to 20V . A small amount of internal capacitance is contained within the package assembly. Additional external input capacitance is required between this pin and the exposed pad (PGND). 3, 5, 6 AGND Analog Ground — Reference point for all stated voltages. Must be externally connected to PGND(EP). 4 EN Enable — Input to the precision enable comparator. Rising threshold is 1.274V typical. Once the module is enabled, a 13 uA source current is internally activated to facilitate programmable hysteresis. 7 FB Feedback — Internally connected to the regulation amplifier and over-voltage comparator. The regulation reference point is 0.795V at this input pin. Connect the feedback resistor divider between VOUT and AGND to set the output voltage. 8 SS Soft-Start/Track Input — To extend the 1.6 mSec internal soft-start connect an external soft start capacitor. For tracking connect to an external resistive divider connected to a higher priority supply rail. See Design Steps for the LMZ12010 Application section. 9 NC No Connect — This pin must remain floating, do not ground. 10, 11 VOUT Output Voltage — Output from the internal inductor. Connect the output capacitor between this pin and exposed pad (PGND). EP PGND Exposed Pad / Power Ground — Electrical path for the power circuits within the module. PGND is not internally connected to AGND (pin 5,6). Must be electrically connected to pins 5 and 6 external to the package. The exposed pad is also used to dissipate heat from the package during operation. Use one hundred 12 mil thermal vias from top to bottom copper for best thermal performance. Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LMZ12010 |
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