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CA04P2S14THSG bảng dữ liệu(PDF) 3 Page - EPCOS |
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CA04P2S14THSG bảng dữ liệu(HTML) 3 Page - EPCOS |
3 / 30 page Features ESD protection level acc. to ISO 10605, IEC 61000-4-2 level 4 Bidirectional protection Capacitance ratings down to 2 pF Low insertion loss Low leakage current No signal distortion RoHS-compatible Suitable for lead-free soldering Applications ESD protection for high-speed data lines such as USB 2.0, firewire, etc. ESD protection for I/O ports of video and audio lines Integrated solutions for connectors in mobile communication and handheld devices Design Multilayer technology Lack of plastic or epoxy encapsulation for flammability rating better than UL 94 V-0 Termination (see “Soldering directions”): CT and CA types with nickel barrier terminations (AgNiSn), recommended for lead-free soldering, and compatible with tin/lead solder. Single chip Internal circuit Available case sizes: EIA Metric 0201 0603 0402 1005 0603 1608 Array Internal circuit 4-fold array Available case sizes: EIA Metric Version 0508 1220 4-fold array 0612 1632 4-fold array Multilayer varistors (MLVs) High-speed series Page 3 of 30 Please read Cautions and warnings and Important notes at the end of this document. |
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