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AD5292BRUZ-50-RL7 bảng dữ liệu(PDF) 10 Page - Analog Devices |
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10 / 32 page AD5291/AD5292 Rev. D | Page 10 of 32 ABSOLUTE MAXIMUM RATINGS TA = 25°C, unless otherwise noted. Table 8. Parameter Rating VDD to GND −0.3 V to +35 V VSS to GND +0.3 V to − 25 V VLOGIC to GND −0.3 V to + 7 V VDD to VSS 35 V VA, VB, VW to GND VSS − 0.3 V, VDD+ 0.3 V Digital Input and Output Voltage to GND −0.3 V to VLOGIC + 0.3 V EXT_CAP Voltage to GND −0.3 V to +7 V IA, IB, IW Continuous RAB = 20 kΩ ±3 mA RAB = 50 kΩ, 100 kΩ ±2mA Pulsed1 Frequency > 10 kHz MCC2/d3 Frequency ≤ 10 kHz MCC2/√d3 Operating Temperature Range4 −40°C to +105°C Maximum Junction Temperature (TJ max) 150°C Storage Temperature Range −65°C to +150°C Reflow Soldering Peak Temperature 260°C Time at Peak Temperature 20 sec to 40 sec Package Power Dissipation (TJ max − TA)/θJA Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θJA is defined by JEDEC specification JESD-51 and the value is dependent on the test board and test environment. Table 9. Thermal Resistance Package Type θJA θJC Unit 14-Lead TSSOP 931 20 °C/W 1 JEDEC 2S2P test board, still air (0 m/sec to 1 m/sec air flow). ESD CAUTION 1 Maximum terminal current is bounded by the maximum current handling of the switches, maximum power dissipation of the package, and maximum applied voltage across any two of the A, B, and W terminals at a given resistance. 2 Maximum continuous current 3 Pulse duty factor. 4 Includes programming of OTP memory. |
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