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AD7817BRU-REEL7 bảng dữ liệu(PDF) 7 Page - Analog Devices

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Data Sheet
AD7817/AD7818
Rev. D | Page 7 of 20
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise noted.
Table 3.
Parameter
Rating
V
DD to AGND
−0.3 V to +7 V
V
DD to DGND
−0.3 V to +7 V
Analog Input Voltage to AGND
V
IN1 to VIN4
−0.3 V to V
DD + 0.3 V
Reference Input Voltage to AGND1
−0.3 V to V
DD + 0.3V
Digital Input Voltage to DGND
–0.3 V to V
DD + 0.3 V
Digital Output Voltage to DGND
–0.3 V to V
DD + 0.3 V
Storage Temperature Range
−65°C to +150°C
Junction Temperature
150°C
16-Lead TSSOP, Power Dissipation
450 mW
θ
JA Thermal Impedance
120°C/W
Lead Temperature, Soldering
260°C
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
16-Lead SOIC Package, Power Dissipation
450 mW
θ
JA Thermal Impedance
100°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
8-Lead SOIC Package, Power Dissipation
450 mW
θ
JA Thermal Impedance
157°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
8-Lead MSOP Package, Power Dissipation
450 mW
θ
JA Thermal Impedance
206°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
1 If the reference input voltage is likely to exceed V
DD by more than 0.3 V (that
is, during power-up) and the reference is capable of supplying 30 mA or more, it
is recommended to use a clamping diode between the REFIN pin and VDD pin.
Connect the diode as shown in this figure.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION


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