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5-104894-5 bảng dữ liệu(PDF) 2 Page - Tyco Electronics

tên linh kiện 5-104894-5
Giải thích chi tiết về linh kiện  Fine Pitch SMT Stacking Connectors
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nhà sản xuất  MACOM [Tyco Electronics]
Trang chủ  http://www.macom.com
Logo MACOM - Tyco Electronics

5-104894-5 bảng dữ liệu(HTML) 2 Page - Tyco Electronics

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89
Catalog 889092
Dimensions are in millimeters
Dimensions are shown for
USA: 1-800-522-6752
South America: 55-11-3611-1514
Revised 9-06
and inches unless otherwise
reference purposes only.
Canada: 1-905-470-4425
Hong Kong: 852-2735-1628
specified. Values in brackets
Specifications subject
Mexico: 01-800-733-8926
Japan: 81-44-844-8013
www.tycoelectronics.com
are standard equivalents.
to change.
C. America: 52-55-5-729-0425
UK: 44-141-810-8967
Page_Head (Continued)
Fine Pitch SMT Stacking Connectors
(Parallel Board-to-Board)
AMPMODU 50/50 Grid Connectors
Product Facts
Surface-mount products for
parallel board-to-board
applications, as well as
right angle board-to-board
and cable-to-board
applications
High density 1.27 x 1.27
[.050 x .050] centerline grid
Three board-to-board stack
heights: 6.35 [.250], 8.13
[.320] and 9.91 [.390]
Non-protrusive metallic
holddowns
Reliable dual beam
receptacle contacts for
redundant contact
Duplex plated receptacle
and post contacts; gold
plated on mating areas,
tin-lead plated on tails
Compatible with standard
surface-mount processing
(VPR and IR)
Receptacle and header
allow for drainage of
processing fluids
Tape and reel packaging
available, contact
Tyco Electronics for details
Polarized header and
receptacle assemblies
Sizes of 10, 20, 30, 40, 50,
60, 70, 80 and 100 positions
Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
File No. E28476
Certified by Canadian
Standards
Association
File No. LR7189
R
R
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are designed
for parallel board-to-board
stacking in high density
applications.
Right angle board-to-board
and cable-to-board applica-
tions are also possible,
since the vertical recepta-
cles also mate with non-
latching right angle headers
(page 95) and the vertical
headers also mate with non-
latching cable connectors.
Available are dual-row,
vertical shrouded headers
and receptacles in sizes
ranging from 10 through
100 positions (in 10 position
increments).
Parallel board-to-board
stack heights of 6.35 [.250],
8.13 [.320] and 9.91 [.390]
are achievable by selection
of the appropriate header.
The receptacle is the same
for all three stack height
headers.
Non-protrusive metallic
holddowns are designed for
use in 1.57 [.062] or thicker
PC boards and allow sur-
face mounting to both sides
of the board. In addition to
providing retention during
processing, the holddowns
are soldered during reflow
and therefore provide long
term strain relief for the lead
solder joints.
AMPMODU 50/50 Grid
Vertical Headers and
Receptacles are compatible
with standard surface-
mount processes; IR
(infrared) and VPR (vapor
phase reflow). The surface-
mount connectors have
been designed so that
dimensioning, tolerances,
referenced datums, hold-
down characteristics and
packaging methods result
in a system that is compati-
ble with robotic assembly.
The headers and recepta-
cles feature polarization to
prevent misalignment.
Three Board Stack Heights
Non-Protrusive
Metallic Holddowns
6.35 ± 0.15
[.250 ± .006]
8.13 ± 0.15
[.320 ± .006]
9.91 ± 0.15
[.390 ± .006]
See Catalog 1307819 for
additional AMPMODU product
offerings.


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