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TS3A226AE bảng dữ liệu(PDF) 1 Page - Texas Instruments |
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1 / 11 page S1 VDD EN MICP SLEEVE RING2 GNDA Control Logic TS3A226AE FET1 FET2 TIP RING1 MIC_BIAS MIC R1 C2 Audio Codec FM Receiver GNDB TS3A226AE www.ti.com SCDS346A – JUNE 2013 – REVISED JULY 2013 Autonomous Audio Headset Switch with Reduced GND Switch RON and FM Capability Check for Samples: TS3A226AE 1 FEATURES DESCRIPTION The TS3A226AE is an audio headset switch that • Ground FET Switches (60m Ω typical) detects 3- or 4-pole 3.5mm accessories. For a 4-pole • Autonomous Detection of Headset Types: accessory with a microphone, the TS3A226AE also 3-Poles or 4-Poles (with MIC on SLEEVE or detects the MIC location and routes the microphone RING2) and ground signals automatically. The ground signal is routed through a pair of low-impedance ground • Microphone Line Switches FETs (60m Ω typical), resulting minimal impact on • Supports FM Signal Transmission Through the audio cross-talk performance. The autonomous Ground FETs detection feature allows end users to plug in • Reduction of Click/Pop Noise accessories with different audio pole configurations into the mobile device and have them operate • VDD Range: 2.6 V – 4.7 V properly with no added software control and • THD (Mic): 0.002% Typical complexity. The ground FETs of the device are • Low Current Consumption: 6.5-µA Typical designed to allow FM signal pass-through, making it possible to use the ground line of the headset as an • ±8kV Contract Discharge (IEC 61000-4-2) ESD FM antenna in mobile audio application. Performance on SLEEVE and RING2 Pins The TS3A226AE is packaged within a 1.2mm × APPLICATIONS 1.2mm WCSP package, making it suitable for use in mobile application. • Mobile Phones / Tablet PCs • Notebook/Ultrabook Computers Figure 1. Typical Application Diagram ORDERING INFORMATION For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2013, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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