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HUFA75531SK8 bảng dữ liệu(PDF) 7 Page - Fairchild Semiconductor |
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HUFA75531SK8 bảng dữ liệu(HTML) 7 Page - Fairchild Semiconductor |
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7 / 11 page  ©2001 Fairchild Semiconductor Corporation HUFA75531SK8 Rev. B defines the RθJA for the device as a function of the top copper (component side) area. This is for a horizontally positioned FR-4 board with 1oz copper after 1000 seconds of steady state power with no air flow. This graph provides the necessary information for calculation of the steady state junction temperature or power dissipation. Pulse applications can be evaluated using the Fairchild device Spice thermal model or manually utilizing the normalized maximum transient thermal impedance curve. Displayed on the curve are RθJA values listed in the Electrical Specifications table. The points were chosen to depict the compromise between the copper board area, the thermal resistance and ultimately the power dissipation, PDM. Thermal resistances corresponding to other copper areas can be obtained from Figure 20 or by calculation using Equation 2. RθJA is defined as the natural log of the area times a coefficient added to a constant. The area, in square inches is the top copper area including the gate and source pads. The transient thermal impedance (ZθJA) is also effected by varied top copper board area. Figure 21 shows the effect of copper pad area on single pulse transient thermal impedance. Each trace represents a copper pad area in square inches corresponding to the descending list in the graph. Spice and SABER thermal models are provided for each of the listed pad areas. Copper pad area has no perceivable effect on transient thermal impedance for pulse widths less than 100ms. For pulse widths less than 100ms the transient thermal impedance is determined by the die and package. Therefore, CTHERM1 through CTHERM5 and RTHERM1 through RTHERM5 remain constant for each of the thermal models. A listing of the model component values is available in Table 1. (EQ. 2) RθJA 83.2 23.6 Area () ln × – = FIGURE 20. THERMAL RESISTANCE vs MOUNTING PAD AREA 120 160 200 240 0.1 1.0 80 0.01 RθJA = 83.2 - 23.6*ln(AREA) 152oC/W - 0.054in2 189oC/W - 0.0115in2 AREA, TOP COPPER AREA (in2) FIGURE 21. THERMAL IMPEDANCE vs MOUNTING PAD AREA 30 60 90 120 150 0 10-1 100 101 102 103 t, RECTANGULAR PULSE DURATION (s) COPPER BOARD AREA - DESCENDING ORDER 0.04 in2 0.28 in2 0.52 in2 0.76 in2 1.00 in2 HUFA75531SK8 |
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