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HUFA75309D3 bảng dữ liệu(PDF) 2 Page - Fairchild Semiconductor |
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2 / 10 page ©2001 Fairchild Semiconductor Corporation HUFA75309P3, HUFA75309D3, HUFA75309D3S Rev. B Absolute Maximum Ratings TC = 25 oC, Unless Otherwise Specified HUFA75309P3, HUFA75309D3, HUFA75309D3S UNITS Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS 55 V Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR 55 V Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS ±20 V Drain Current Continuous (Figure 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM 19 Figure 4 A Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS Figures 6, 14, 15 Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 0.37 W W/oC Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG -55 to 175 oC Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg 300 260 oC oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. TJ = 25 oC to 150oC. Electrical Specifications TC = 25 oC, Unless Otherwise Specified PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS OFF STATE SPECIFICATIONS Drain to Source Breakdown Voltage BVDSS ID = 250µA, VGS = 0V (Figure 11) 55 - - V Zero Gate Voltage Drain Current IDSS VDS = 50V, VGS = 0V - - 1 µA VDS = 45V, VGS = 0V, TC = 150 oC- - 250 µA Gate to Source Leakage Current IGSS VGS = ±20V - - ±100 nA ON STATE SPECIFICATIONS Gate to Source Threshold Voltage VGS(TH) VGS = VDS, ID = 250µA (Figure 10) 2 - 4 V Drain to Source On Resistance rDS(ON) ID = 19A, VGS = 10V (Figure 9) - 0 .060 0.070 Ω THERMAL SPECIFICATIONS Thermal Resistance Junction to Case RθJC (Figure 3) - - 2.7 oC/W Thermal Resistance Junction to Ambient RθJA TO-220 - - 62 oC/W TO-251, TO-252 - - 100 oC/W SWITCHING SPECIFICATIONS (VGS = 10V) Turn-On Time tON VDD = 30V, ID ≅ 19A, RL = 1.58Ω, VGS = 10V, RGS = 27Ω - - 70 ns Turn-On Delay Time td(ON) -7- ns Rise Time tr -39 - ns Turn-Off Delay Time td(OFF) -24 - ns Fall Time tf -30 - ns Turn-Off Time tOFF - - 80 ns GATE CHARGE SPECIFICATIONS Total Gate Charge Qg(TOT) VGS = 0V to 20V VDD = 30V, ID ≅ 19A, RL = 1.58Ω Ig(REF) = 1.0mA (Figure13) -20 24 nC Gate Charge at 10V Qg(10) VGS = 0V to 10V - 11 13.5 nC Threshold Gate Charge Qg(TH) VGS = 0V to 2V - 0.68 0.85 nC Gate to Source Gate Charge Qgs -1.8 - nC Reverse Transfer Capacitance Qgd -5- nC HUFA75309P3, HUFA75309D3, HUFA75309D3S |
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