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ADM7160 bảng dữ liệu(PDF) 5 Page - Analog Devices |
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ADM7160 bảng dữ liệu(HTML) 5 Page - Analog Devices |
5 / 24 page Data Sheet ADM7160 Rev. 0 | Page 5 of 24 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating VIN to GND −0.3 V to +6.5 V VOUT to GND −0.3 V to VIN EN to GND −0.3 V to +6.5 V Storage Temperature Range −65°C to +150°C Operating Junction Temperature Range −40°C to +125°C Operating Ambient Temperature Range −40°C to +125°C Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL DATA Absolute maximum ratings apply individually only, not in combination. The ADM7160 can be damaged when the junc- tion temperature limits are exceeded. Monitoring ambient temperature does not guarantee that TJ is within the specified temperature limits. In applications with high power dissipation and poor PCB thermal resistance, the maximum ambient temperature may need to be derated. In applications with moderate power dissipation and low PCB thermal resistance, the maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within the specification limits. The junction temperature (TJ) of the device is dependent on the ambient temperature (TA), the power dissipation of the device (PD), and the junction-to-ambient thermal resistance of the package (θJA). TJ is calculated using the following formula: TJ = TA + (PD × θJA) The junction-to-ambient thermal resistance (θJA) of the package is based on modeling and calculation using a 4-layer board. θJA is highly dependent on the application and board layout. In appli- cations where high maximum power dissipation exists, close attention to thermal board design is required. The value of θJA may vary, depending on PCB material, layout, and environmental conditions. The specified values of θJA are based on a 4-layer, 4 inch × 3 inch printed circuit board (PCB). See JEDEC JESD51-7 and JESD51-9 for detailed information about board construction. For more infor- mation about the LFCSP package, see the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP). ΨJB is the junction-to-board thermal characterization parameter with units of °C/W. ΨJB of the package is based on modeling and calculation using a 4-layer board. JEDEC JESD51-12, Guidelines for Reporting and Using Electronic Package Thermal Information, states that thermal characterization parameters are not the same as thermal resistances. ΨJB measures the component power flowing through multiple thermal paths, rather than through a single path as in thermal resistance (θJB). Therefore, ΨJB thermal paths include convection from the top of the package, as well as radiation from the package, factors that make ΨJB more useful in real-world applications. Maximum junction temperature (TJ) is calculated from the board temperature (TB) and the power dissipation (PD) using the following formula: TJ = TB + (PD × ΨJB) See JEDEC JESD51-8 and JESD51-12 for more detailed infor- mation about ΨJB. THERMAL RESISTANCE θJA and ΨJB are specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 4. Thermal Resistance Package Type θJA ΨJB Unit 5-Lead TSOT 170 43 °C/W 6-Lead LFCSP 63.6 28.3 °C/W ESD CAUTION |
Số phần tương tự - ADM7160 |
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Mô tả tương tự - ADM7160 |
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