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ADS42JB69IRGCR bảng dữ liệu(PDF) 2 Page - Texas Instruments |
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ADS42JB69IRGCR bảng dữ liệu(HTML) 2 Page - Texas Instruments |
2 / 70 page ADS42JB49 ADS42JB69 SLAS900C – OCTOBER 2012 – REVISED JULY 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE ADS42JB49(2) QFN-64 RGC –40°C to +85°C ADS42JB69 QFN-64 RGC –40°C to +85°C (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. (2) Product preview device. ABSOLUTE MAXIMUM RATINGS Over operating free-air temperature range, unless otherwise noted. VALUE UNIT AVDD3V –0.3 to 3.6 V AVDD –0.3 to 2.1 V Supply voltage range DRVDD –0.3 to 2.1 V IOVDD –0.3 to 2.1 V Voltage between AGND and DGND –0.3 to 0.3 V INAP, INBP, INAM, INBM –0.3 to 3 V CLKINP, CLKINM –0.3 to minimum (2.1, AVDD + 0.3) V SYNC~P, SYNC~M –0.3 to minimum (2.1, AVDD + 0.3) V Voltage applied to input pins SYSREFP, SYSREFM –0.3 to minimum (2.1, AVDD + 0.3) V SCLK, SEN, SDATA, RESET, PDN_GBL, –0.3 to 3.9 V CTRL1, CTRL2, STBY, MODE Operating free-air, TA –40 to +85 °C Temperature range Operating junction, TJ +125 °C Storage, Tstg –65 to +150 °C Electrostatic discharge (ESD) rating Human body model (HBM) 2 kV THERMAL INFORMATION ADS42JB49, ADS42JB69 THERMAL METRIC(1) UNITS RGC (QFN) 64 PINS θJA Junction-to-ambient thermal resistance 22.9 θJCtop Junction-to-case (top) thermal resistance 7.1 θJB Junction-to-board thermal resistance 2.5 °C/W ψJT Junction-to-top characterization parameter 0.1 ψJB Junction-to-board characterization parameter 2.5 θJCbot Junction-to-case (bottom) thermal resistance 0.2 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 2 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated Product Folder Links: ADS42JB49 ADS42JB69 |
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