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ADG712BRU-REEL bảng dữ liệu(PDF) 5 Page - Analog Devices

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ADG712BRU-REEL bảng dữ liệu(HTML) 5 Page - Analog Devices

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ADG711/ADG712/ADG713
Rev. B | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
TA = +25°C, unless otherwise noted.
Table 3.
Parameter
Rating
VDD to GND
−0.3 V to +6 V
Analog, Digital Inputs1
−0.3 V to VDD +0.3 V or
30 mA, whichever occurs
first
Continuous Current, S or D
30 mA
Peak Current, S or D
100 mA (Pulsed at 1 ms,
10% duty cycle maximum)
Operating Temperature Range
−40°C to +85°C
Storage Temperature Range
−65°C to +150°C
Junction Temperature
150°C
TSSOP Package, Power Dissipation
430 mW
θJA Thermal Impedance
150°C/W
θJC Thermal Impedance
27°C/W
SOIC Package, Power Dissipation
520 mW
θJA Thermal Impedance
125°C/W
θJC Thermal Impedance
42°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec)
215°C
Infrared (15 sec)
220°C
Soldering(Pb-Free)
Reflow, Peak Temperature
260(+0/−5)°C
Time at Peak Temperature
20 sec to 40 sec
ESD
2 kV
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating may be applied at any
one time.
ESD CAUTION
1 Overvoltages at IN, S or D will be clamped by internal diodes. Currents
should be limited to the maximum ratings given.


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