SM15TY

Characteristics

Doc ID 17865 Rev 3

5/12

Figure 11.

Relative variation of thermal impedance junction to ambient versus pulse duration

Figure 9.

Leakage current versus junction

temperature (typical values)

Figure 10.

Peak forward voltage drop versus

peak forward current

(typical values)

I (nA)

R

1.E+00

1.E+01

1.E+02

1.E+03

1.E+04

25

50

75

100

125

150

T (°C)

j

V= V

RRM

V

< 10 V

RM

V10 V

0.1

1.0

10.0

100.0

0.0

0.5

1.0

1.5

2.0

2.5

V

(V)

FM

I (A)

FM

T = 25 °C

j

T = 125 °C

j

0.01

0.10

1.00

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

1.E+03

Recommended pad layout

Single pulse

printed circuit board,

copper thickness = 35 µm

Z/R

th(j-a)

th(j-a)

t (s)

p