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MCP1755 bảng dữ liệu(PDF) 5 Page - Microchip Technology |
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MCP1755 bảng dữ liệu(HTML) 5 Page - Microchip Technology |
5 / 40 page 2012 Microchip Technology Inc. DS25160A-page 5 MCP1755/1755S 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Input Voltage, VIN.........................................................+17.6V VIN, PWRGD, SHDN................. (GND – 0.3V) to (VIN +0.3V) VOUT................................................. (GND – 0.3V) to (+5.5V) Internal Power Dissipation ............ Internally-Limited (Note 6) Output Short Circuit Current ................................. Continuous Storage temperature .....................................-55°C to +150°C Maximum Junction Temperature....................+165°C(Note 7) Operating Junction Temperature...................-40°C to +150°C ESD protection on all pins kV HBM and 400V MM † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. AC/DC CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all limits are established for VIN =VR +1V, Note 1, ILOAD =1 mA, COUT = 1 µF (X7R), CIN = 1 µF (X7R), TA =+25°C, tr(VIN) = 0.5 V/µs, SHDN =VIN, PWRGD = 10K to VOUT. Boldface type applies for junction temperatures, TJ (Note 7) of -40°C to +125°C. Parameters Sym. Min. Typ. Max. Units Conditions Input/Output Characteristics Input Operating Voltage VIN 3.6 — 16.0 V Output Voltage Operating Range VOUT-RANGE 1.8 — 5.5 V Input Quiescent Current Iq —68 100 µA IL =0 mA Input Quiescent Current for SHDN mode ISHDN —0.1 4 µA SHDN =GND Ground Current IGND —300 400 µA ILOAD = 300 mA Maximum Output Current IOUT_mA 300 —— mA Output Soft Current Limit SCL — 450 — mA VOUT 0.1V, VIN =VIN(MIN), Current measured 10 ms after the load is applied Output Pulse Current Limit PCL — 350 — mA Pulse Duration < 100 ms, Duty Cycle < 50%, VOUT 0.1V, Note 6 Output Short Circuit Foldback Current IOUT_SC —30 — mA VIN =VIN(MIN), VOUT =GND Output Voltage Overshoot on Start-up VOVER —0.5 — %VOUT VIN =0 to 16V, ILOAD = 300 mA Note 1: The minimum VIN must meet two conditions: VIN 3.6V and VIN VR + VDROPOUT(MAX). 2: VR is the nominal regulator output voltage when the input voltage VIN =VRated +VDROPOUT(MAX) or VIN = 3.6V (whichever is greater); IOUT =1 mA. 3: TCVOUT =(VOUT-HIGH –VOUT-LOW)x 106/(VR x Temperature), VOUT-HIGH = highest voltage measured over the temperature range. VOUT-LOW = lowest voltage measured over the temperature range. 4: Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Changes in output voltage due to heating effects are determined using thermal regulation specification TCVOUT. 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below the output voltage value that was measured with an applied input voltage of VIN =VR +1V or VIN = 3.6V (whichever is greater). 6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability. 7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in the junction temperature over the ambient temperature is not significant. 8: See Section 4.6 “Shutdown Input (SHDN)” and Figure 2-34. |
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