 2003-2012 Microchip Technology Inc.

DS21333C-page 3

TC1302A/B

1.0

ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings †

Power Dissipation ..........................Internally Limited (Note 7)

Storage temperature .....................................-65°C to +150°C

Continuous Operating Temperature Range ..-40°C to +125°C

ESD protection on all pins, HBM, MM

4 kV, 400V

† Notice: Stresses above those listed under “Maximum Rat-

ings” may cause permanent damage to the device. This is a

stress rating only and functional operation of the device at

those or any other conditions above those indicated in the

operational listings of this specification is not implied. Expo-

sure to maximum rating conditions for extended periods may

affect device reliability.

DC CHARACTERISTICS

Boldface type specifications apply for junction temperatures of -40°C to +125°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Input Operating Voltage

2.7

—

6.0

V

Note 1

Maximum Output Current

300

——

mA

Maximum Output Current

150

——

mA

Output Voltage Tolerance

%

Note 2

Temperature Coefficient

—

25

—

ppm/°C

Note 3

Line Regulation

V

—0.02

0.2

%/V

V

-1

0.1

+1

V

-1.5

0.1

+1.5

Thermal Regulation

V

—0.04

—

%/W

Note 5

Dropout Voltage (Note 6)

—

104

180

mV

—

150

250

mV

Supply Current

TC1302A

—

103

180

µA

TC1302B

—114

180

µA

Note

1:

2:

3:

4:

Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested

over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating

effects are covered by the thermal regulation specification.

5:

Thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied,

6:

Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its

value measured at a 1V differential.

7:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

dissipation causes the device to initiate thermal shutdown.